Call for Papers
International Symposium on Advanced Packaging Materials: Processing, Properties, and Interfaces
Chateau Elan, Braselton, Georgia – March 6-8, 2000
Sponsors: IEEE-CPMT, IMAPS, PRC
General Chair:
C.P. Wong, Ph.D
Georgia Institute of Technology
Tel: 404 894 8391; Fax: 404 894 9140
email: cp.wong@mse.gatech.edu
Technical Program Co-chairs:
Prof. James E. Morris
SUNY Binghamton
Tel: 607 777 4774: Fax: 607 777 4464
email: jmorris@binghamton.edu

Philip Garrou, Ph.D.
Dow Chemical Company
Tel: 919 248 9261; Fax: 919 248 9265
email: pegarrou@dow.com
Tentative Sessions on:
Adhesives
Bumping Materials & Processing
Chip Scale Packaging Materials
Integral Passive Materials
Interfacial Adhesion
Materials Process Control
Mechanics of Materials
Microwave Materials
On-chip Interconnect Materials
Optoelectronics
High Density Substrates
Thermal Management Materials
Underfills & Encapsulant Materials
Wafer Level CSP
To submit Abstract:
Send 200 word abstract by September 1, 1999 (or try a late submittal) to:
Materials 2K, c/o IMAPS Program Management
1850 Centennial Park Drive, Suite 105
Reston VA 20191-1517
Tel: 703 758 1060, Fax 703 758 1066, email abstracts@imaps.org