2000 IEEE Computer Packaging Japan Workshop
Hikone Prince Hotel Japan
January 24 through 26, 2000
The IEEE Computer Packaging Japan Committee would like to invite you to participate in the 2000 IEEE Packaging Workshop to be held at the Hikone Prince Hotel in Hikone City right on the beach of Lake Biwa in January at the start of the new Millennium.
The workshop covers the packaging technology from mainframe computers to personal devices. Also the committee has a plan of special sessions and a joint tour of Castle Hikone and a PWB manufacturing plant.
All attendees are expected to participate in the discussion during the workshop, as part of the give-and-take needed to keep the field healthy.
The location of the Hikone prince Hotel can be reached in 45 minutes by Shinkansen (fast train) from Osaka.
Guidelines: No proceedings will be published. Papers presenting new developments or critical overviews are being solicited.
Registration fee: A $370 (at 120 yen/$) fee covers lunches and drinks from Monday through Wednesday and two diners (Monday and Tuesday). The Hotel fee is $75/night.
Contact:
Shuhei Tsuchita
Packaging Technology Development,
IBM Japan, Ltd., Yasu
800 Ichimiyake, Yasu-cho, Yasu-gun,
Shiga, 520-2392, Japan
Tel: +81-77-587-6161, Fax: +81-77-587-4733,
email: tsuchita@jp.ibm.com
KeyNote Session: There are 3 papers planned that will cover global trends in packaging and information technology.
Technical Sessions:
#1: Packaging technology for high performance system. System and technology packaging for super computers, servers, ATMs and workstations.
#2: Cooling and noise management. Design methodology and Element technology in various applications.
#3: Packaging technology in SMART card and IC card. Design and packaging technology used in SMART card and IC card area.
#4: Flip chip, substrate and CSP/BGA packaging technology. Material and process for micro packaging technologies.
#5: Packaging technology for high frequency and wireless application. RF design method and requirement to packaging technology.
#6: Environment, safety and health technology. Environment, safety and health conscious materials - EMI, Lead free, halogen free, recycle, etc.
Special Session:
Four presentations are planned on the "standardization" theme:
*Standardization activity in packaging area
*Requirements for semiconductors, substrates, and KGD.
*New requirements for future packaging technology.
*Introduction to automotive and optical packaging