8th Topical Meeting on
Electrical Performance of Electronic Packaging
IPEP ’99
October 25-27, 1999
Catamaran Resort Hotel
San Diego, California
Sponsors: CPMT and MTT Societies
Co-Chairs:
M. Swaminathan, Georgia Institute of Technology
Ravi Kaw, Hewlett Packard
The general subject of the meeting is the electrical design, analysis, and characterization of electronic interconnections and packaging structures for performance-driven, high speed/high complexity electronic systems. A forum will be provided for the discussion of the following topics as they relate to chip-to-chip and on-chip interconnections in electronic systems:
**Package analysis, including numerical methods and algorithms, electro-magnetic analysis tools; advances in transmission-line techniques.
**RF/microwave packaging structures and their electrical performance.
**MMIC modules and high density packaging.
**Experimental characterization techniques and testing procedures.
**EMC/EMI effects; prediction and measurement of radiation from inter-connect structures and packaged systems; EMI sources (on-dash chip and of) and novel solutions.
**Electrical design implications for low cost, high volume packaging.
**Optoelectronic packaging; structure and system applications.
**Packaging concerns for wireless communication; design and modeling.
**Current and future issues related to on-chip interconnections; performance evaluation tool development.
**New and innovative interconnect and packaging structures and their electrical performance.
**Power distribution and package resonance; advances in modeling core switching noise, and design of novel solutions.
Additional information may be obtained form the conference web page [http://intermix.engr.arizona.edu/~epd/#EPEP]
or from the co-chairs email: madhavan.swaminathan@ee.gatech.edu or ravi_kaw@hp.com
Short Courses
Short courses and one-hour lectures will be offered October 24, the Sunday before the start of the conference.
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Individual company sponsorship of the breaks is greatly appreciated, and facilities are provided for displaying advertising materials.