Berlin is in Array!
The German Chapter of IEEE-CPMT organized a Conference on Area Array Packaging Technologies. This Workshop-style meeting is November 15-17, 1999 in Berlin right after the large gathering for "Productronica". Flip Chip and Ball Grid Arrays are the focus for this meeting that will have sequential sessions so all attendees will be able to comment on every paper. Talks will be about 30 minutes with time for questions.
Dr. Elke Zakel is the conference Chairman. The international advisory committee consists of William Beckenbaugh of Motorola/USA, Dr. Koji Nihei of Oki Electric Industry Japan, and Paul Totta of IBM/USA. Technical Exhibits will also be at the meeting.
For more information use email: [erlebach@pactel.de]