UPCOMING MEETING OF CPMT
THERMINIC Workshop
Rome, Italy October 3-5, 1999
Contact Bernard Courtois bernard.courtois@imag.fr
1-33-4-76-57-46-15 fax 1-33-4-76-47-38-14
IEEE Holm Conference on Electrical Contacts
Pittsburgh, Pennsylvania October 4-6, 1999
Contact: Marie Leonardis, IEEE ITCMS or g.witter@ieee.org
1999 International Symposium on Semiconductor Manufacturing
Santa Clara, California October 11-13, 1999
Contact William Van Der Vort (EDS) (732)562-3926
25th International Electronics Manufacturing Technology Conference
(IEMT)
Austin, Texas 18-20 October, 1999
Contact: Jim Steele, james.steele@medtronic.com, (602) 517-3886
IMAPS ATW: Packaging of MEMS & Microsystems
Chicago, Illinois October 23-24, 1999
Contact: Ajay Malshe apm2@engr.uark.edu
2nd Polymeric Electronics Packaging (PEP’99) Conference
Goteborg, Sweden October 24-27, 1999
Contact: Johan Liu johan.liu@ivf.se
1999 IEEE Workshop on Accelerated Stress Testing (AST’99),
Wakefield, Massachusetts October 26/27, 1999
Contact: T. Paul Parker tpparker@lucent.com
(972)284-2295 fax (972)284-8374
2nd Annual Microelectronics Reliability and Qualification Workshop
October 26-27, 1999 Pasadena, California
Web page: [http://parts.jpl.nasa.gov/workshop/home.htm]
Area Array Packaging Technologies,
Berlin, Germany November 15-17, 1999
Contact: Dr. Elke Zakel: Fax +49 30 467 815 – 51, email:
zakel@pactech.de
2nd Annual Polymeric Materials for Microelectronics & Photonics
Applications, Poly’99, Paris, France
December 12-15, 1999, Contact Brian Bigalke (ASME)
bigalkeb@asme.org, (212)591-7057, fax (212)591-7856
8th Topical Meeting on Electrical Performance of Electronic
Packaging (EPEP’99), San Diego, California October 25-27,
1999
Contact: Paul Baltes epd@engr.arizona.edu 520 621 5104
APACK’99: Symposium on Advances in Packaging
Singapore December 12-15, 1999
Contact: apack99@gintic.gov.sg
2000 IEEE Computer Packaging Japan Workshop
Hikone City, Japan January 24 – 26, 2000
Contact: Shuhei Tsuchita, e-mail : tsuchita@jp.ibm.com
3rd Annual International Workshop on Electronic Components
for the Commercialization of Military $ Space Systems
Los Angeles, California January 30 – February 2, 2000
Contact: Dale Stamps dale@cti-us.com http://www.cti-us.com
6th International Symposium on Advanced Packaging Materials,
Braselton Georgia March 6-8, 2000
Contact 1-888-GO-IMAPS www.imaps.org
Semiconductor Thermal Measurement & Management Symposium
San Jose, California March 21-23, 2000
Contact: Paul Baltes epd@engr.arizona.edu http://thermengr.com
CARTS 2000 (20th Capacitor and Resistor Technology Symposium)
Huntington Beach, California March 6 – 10, 2000
Contact: CTI at Phone 256 536 1304, Fax 256 539 8477
2000 IEMT/IMC Symposium
Omiya Sonic City, Japan April 19-21, 2000
Contact: email: IMAPS@ruby.famille.ne.jp
Computer and System Packaging Workshop,
Indian Wells, California May 2-4, 2000
Contact: General Chair Len Alton , email: len.alton@unisys.com
Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS
(Confer. CAD, Design & Test/Confer. Microfabrication, Integration
& Packaging), Paris, France May 9 – 11, 2000
Contact: Bernard Courtois bernard.courtois@imag.fr
50th Electronic Component & Technology Conference
Caesar’s Palace, Las Vegas Nevada May 21-24, 2000
Contact: Jim Bruorton, Fax 864 963 6521, email: margieballinger@kemet.com
Itherm 2000,
Caesar’s Palace, Las Vegas, Nevada May 23-26, 2000
Contact: Paul Baltes, Phone: 520 621 3054, email: epd@engr.arizona.edu
4th International Conference on Adhesive Joining and
Coating Technology in Electronic Manufacturing
Helsinki, Finland June 18-21, 2000
Contact: Jorma Kivilahti jorma.kivilahti@hut.fi
2nd International Workshop on Integrated Power Packaging
Boston, Massachusetts Late June or July 1999
Contact: Doug Hopkins d.hopkins@ieee.org
Next Generation IC & Packaging Design
Solvang, California July 15 – 17, 1999
Contact: www.imaps.org
3rd Electronics Packaging Technology Conference (EPTC’2000)
Singapore December 5-7, 2000
Contact: T. B. Lim tblim@ime.org.sg http://cicfar.ee.nus.sg/eptc.html