Call for Papers
ECTC Gaming Las Vegas
The 50th Electronic Components and Technology Conference will be held May 21 – 24, 2000 at Caesars Palace in Las Vegas, Nevada. This is the BIG meeting for members of the CPMT Society; if your boss only lets you go to one meeting, this is the one.
This international conference offers a wide spectrum of topics including not only electronic components, but also exciting new developments in all areas of electronics technology (e.g., electronics assembly, packaging, reliability, and materials). Last year over 230 papers, posters, and short courses were presented to a very eclectic audience of 900 (see review elsewhere in this Newsletter).
The theme of this conference is technological innovations in areas of design, materials, processes, quality, and manufacturing of devices, components, and systems.
Submission: A 500 word abstract describing the scope, content, uniqueness, and key points of the paper may be submitted in Adobe Acrobat (pdf), html, or MS Word format. Papers will be accepted as oral or poster presentations based on the abstract received. Send a copy of the abstract and no more than two subcommittee suggestions with your phone number, email address of presenting author, affiliations of all authors, and facsimile number by October 15, 1999 to:
Michael B. McShane Phone: 512 933 6403
Motorola Fax: 512 933 5844
3501 Ed Bluestein Blvd.
MD-K1
Austin, TX 78721
Paper acceptance will be by December 15.
Technical Subcommittees:
Advanced Packaging = new packaging technologies, designs, materials, and configurations addressing performance density and cooling for single and multichip packages. Special emphasis on flip-chip, fine pitch and high lead count packaging in CSP, BGA, CGA, LGA, SMT packages.
Components & RF = new passive or active component technologies, integrated/embedded components, RF & wireless component application, component performance, systems and reliability.
Connectors & Contacts = new or improved devices or techniques, emphasis on high density and performance for multichip, surface mount applications, WLBI and automotive.
Education = education for engineering curricula in the 21st century and collaborative research and engineering programs between universities, government or industry.
Interconnections = first level electronic interconnection technologies including flip-chip, wirebonding, TAB and conductive polymers for temporary or permanent interconnects; wafer, device and substrate-level interconnection metallizations and MEMS interconnects.
Manufacturing Technology = Statistical process controls, ISO compliance, cost reengineering and improvements, new robotics, tooling or equipment, early manufacturing involvement initiatives, yield and test innovations used to enhance manufacturing processes related to high density substrates, packaging, chip bumping and integrated component technologies.
Materials & Processing = adhesives, interconnection materials, ceramics, metals, composites, thermal materials.
Modeling & Simulation = Electrical, thermal, optical, mechanical modeling, simulation, characterization and packaging solutions.
Optoelectronics = packaging for fiber-optic modules, infrared wireless, consumer opto-electronics, flat-panel, projection and micro-displays, optical amplifiers, lasers, detectors, waveguides OEICs, passive components and WDMs.
Quality and Reliability = assessment failure analysis, reliability testing and data analysis, accelerated models, qualification of components and systems, KGD incremental quality improvement, TQM.