APACK'99

8th - 10th December 1999

Singapore

web site [www.gintic.gov.sg/apack99.html]

An international symposium on Advances in Electronics Packaging.

Keynote Addresses: December 8

"Recent Advances on High Performance Low-cost Flip-chip Packaging" by Prof. C. P. Wong, Georgia Institute of Technology

"Current Status and Future Trends of Semiconductor Packaging Industry" by Mr. Takao Fujitsu, Toshiba Corporation.

Tutorial Sessions: December 8

"Polymers for Electronic Packaging: Materials, Process & Reliability" by Prof. C. P. Wong

"Solder Joint Reliability of BGA, CSP, and Flip Chip Assemblies" by Dr. Yi-Hsin Pao

"SMT and Advanced Packaging Design for Manufacturability, Test, and Repair" by Mr. Ray Prasad

Technical Sessions: December 9 - 10

Flip Chip, CSP, BGA, MEMS, Processes & Materials, Modeling & Simulation, Reliability, Inspection, Thermal Design & Management