8th - 10th December 1999
web site [www.gintic.gov.sg/apack99.html]
An international symposium on Advances in Electronics Packaging.
Keynote Addresses: December 8
"Recent Advances on High Performance Low-cost Flip-chip Packaging" by Prof. C. P. Wong, Georgia Institute of Technology
"Current Status and Future Trends of Semiconductor Packaging Industry" by Mr. Takao Fujitsu, Toshiba Corporation.
Tutorial Sessions: December 8
"Polymers for Electronic Packaging: Materials, Process & Reliability" by Prof. C. P. Wong
"Solder Joint Reliability of BGA, CSP, and Flip Chip Assemblies" by Dr. Yi-Hsin Pao
"SMT and Advanced Packaging Design for Manufacturability, Test, and Repair" by Mr. Ray Prasad
Technical Sessions: December 9 - 10
Flip Chip, CSP, BGA, MEMS, Processes & Materials, Modeling & Simulation, Reliability, Inspection, Thermal Design & Management