CALL FOR PAPERS
2000 VLSI Packaging and Microsystem Packaging Techniques and Manufacturing Technologies Workshop
8-9 May 2000, Cork, IRELAND
The IEEE CPMT Society is sponsoring the next VLSI Packaging. The Workshop will be held at the Hayfield Manor Hotel, in Cork, Ireland.
The Workshop is a continuation of the successful series of IEEE-CPMT workshops held in Europe on Electronic packaging to stimulate the activities and important initiatives in this rapidly changing area. This Workshop succeeds the previous Workshop held in Baveno, Italy in 1996, Brugge, Belgium 1998 and alternates with the IEEE European System Packaging Workshop held in Malta in 1997 and in Ireland, 1999 .
All attendees are expected to be specialist in their respective fields and to participate in the relevant discussions. The language of the Workshop will be English with 30 minutes presentations.
The conference will provide a forum for the presentation and discussion of significant progress in VLSI packaging. The topics covered in the Workshop will include methodologies for design and implementation of first level electronic packaging and technologies, materials, and equipment for the manufacturing of multi and single chip packages for VLSI, subsystems and microsystems.

Paper should cover relevant topics including but not limited to:
**Single chip packages, design, implementation, characterisation, and roadmaps
**Product-oriented microelectronics packaging technology
MCM (L,C,D), integrated passives, Large Area Processing, and roadmaps
**Trends in CSP and wafer level packaging
**Flip chip technologies (bumping, assembly, underfill)
**Packaging and interconnection of high frequency devices
**Packaging and interconnection of sensors and microsystems
**3D packaging, optical interconnects, optoelectronic packaging
**Interconnect Technologies for high density organic packaging
**Test and Inspection, KGD, EMC, Thermal management, Reliability, and Cost
Technical Program Committee
John Barrett, NMRC
R. Aschenbrenner, IZM-Berlin, Germany
Jean Roggen, IMEC, Belgium
D. Lang, IZM-Berlin, Germany
Nick Chandler, GEC-Marconi, UK
Claude Massit, LETI-CEA, France
George Harman, NIST, USA
Daniel Lambert, Bull, France
Jean Joly, Bull, France
Tadatomo Suga, University Tokyo, Japan
Gerard Nicolas, LETI-CEA, France
Herbert Reichl, TU Berlin, Germany
For More Information and Registration:
Dr. Rolf Aschenbrenner, FhG IZM
Gustav Meyer Allee 25
13355 Berlin, Germany
or email at aschenbr@izm.fhg.de