Advanced Packaging Materials Processes, Properties and Interfaces

March 6-8, 2000
Chateau Elan
Braselton, Georgia

General Chair:
C.P. Wong
Georgia Institute of Technology

Technical Chairs:
Philip Garrou, Dow Chemical Company
James E. Morris, SUNY Binghamton

Technical Program

Session 1: Adhesives
Co-Chairs: Quinn Tong, National Starch and Chemical Company; Johan Liu, IVF

Session 2: Integrated Passives
Co-Chairs: James Young, Intarsia Corporation, Timothy G. Lenihan, Sheldahl, Inc.

Session 3: Underfill
Co-Chairs: Daniel Baldwin, Georgia Institute of Technology; Ray Pearson, Lehigh University

Session 4: Encapsulation
Co-Chairs: Ken Gilleo, Alpha Metals/Cookson; S.H. Shi, Georgia Institute of Technology

Session 5: Flip Chip Bumping
Co-Chairs: Phil Deane, MCNC; Rolf Aschenbrenner, Fraunhofer Institute

Session 6: Solder
Co-Chairs: Andrew Strandjord, IC Interconnect; Rajen Chanchani, Sandia National Laboratory

Session 7: Flip Chip
Co-Chairs: Jianmin Qu, Georgia Institute of Technology; Li Li, Motorola

Poster Session
Chair: C.P. Wong, Georgia Institute of Technology

Session 8: Chip Scale Packages
Co-Chairs: Michael J. Toepper, TUB/Fraunhofer IZM; Peter Elenius, Flip Chip Technologies

Session 9: High Density Substrates
Co-Chairs: Petri Savolainen, Nokia-Japan Co., Ltd.; Andreas Schubert, Fraunhofer Institute

Session 10: Thermomechanics
Co-Chair: Suresh Sitaraman, Georgia Institute of Technology
Professional Development Courses - Sunday, March 5

Polymers for Electronic Packaging:
Materials, Processes and Reliability (1/2 Day)
1:30 pm - 5 pm

Professor C.P. Wong
School of Materials Science and Engineering
Packaging Research Center
Georgia Institute of Technology

Objectives of the Course

Polymers are widely used in electronic packaging as adhesives, encapsulants, insulators, dielectrics, molding compounds and conducting elements for interconnects. These materials also play a critical role in the recent advances of low-cost, high performance reliability without hermeticity (RWOH), multichip module (MCM), Chip-On-Board (COB), Ball Grid Array (BGA) and Chip Scale Packaging (CSP). It is imperative that materials suppliers and users have a thorough understanding of polymeric materials and their importance in the advances of the electronic packaging and interconnect technologies.

Who Should Attend this Course?

The course is designed for engineers and scientists who are involved with the design, process and manufacturing of IC electronic components and hybrid MCM packaging; for electronic material suppliers who are actively engaging in materials R&D, and managers who want to keep abreast of the latest developments in polymeric materials in electronic packaging.

Introduction to Electrically Conductive Adhesives (1/2 Day)
1:30 pm - 5 pm

James E. Morris, Ph.D.
Department of Electrical Engineering
T. J. Watson School of Engineering & Applied Science
State University of New York at Binghamton

Objectives of the Course

The course covers the primary concepts of both isotropic (ICA) and anisotropic (ACA) forms of electrically conductive adhesives (ECAs,) but with a focus on the ICA. The treatment of ACA materials includes both paste and anisotropic (z-axis) conductive film (ACF) forms. The primary goal of the course is to develop the structure-property relationships of each of the materials, with a sound understanding of how ICA structure, for example, determines its electrical properties. Design criteria are covered as part of this development, which leads to the interpretation of reliability data in terms of failure modes. In all cases, research data from the literature is used to illustrate the issues discussed.
Technical Program

Monday, March 6

Registration: 7 am - 12:30 pm

Session 1:
Adhesives
8am – 10:05am
Session Chair:
Quinn Tong, National Starch and Chemical Company
Johan Liu, IVF

NCF™ & NCP™ New Assembly Solutions for High Volume Manufacturing of PFC™, Flip Chip Devices
Richard H. Estes, Polymer Flip Chip Corporation

Development of a Novel Electrically Conductive Adhesives
Daoqiang Lu, C.P. Wong, Georgia Institute of Technology

Advancing Materials using Interfacial Process and Reliability Simulations on the Molecular Level
N. E. Iwamoto, Johnson Matthey Electronics

Novel Conductive Adhesives with Stable Conductivity and High Impact Resistance
Quinn K. Tong, Eric Zhang, National Starch and Chemical Company; Gerry Frederickson, Rose Schultz, Emerson and Cuming Specialty Polymers

Novel Conductive Adhesives for Solder Replacement in Electronic Packaging
Daoqiang Lu, C.P. Wong, Georgia Institute of Technology

Break: 10:05 am - 10:25 am

Session 2:
Integrated Passives
10:25am - 12:30pm
Session Chairs:
James Young, Intarsia Corporation
Timothy Lenihan, Sheldahl, Inc.

Fundamental Design Boundaries for the Dielectric Thin-Films
Eugene J. Rymaszewski, Jin Young Kim, Toh-Ming Lu, RPI

Novel High Dielectric Constant Polymer-ceramic Composite for Embedded Capacitor Application
Yang Rao, S. Ogitani, C.P. Wong, Georgia Institute of Technology

Materials Options for Dielectrics in Integrated Capacitors
Richrd Ulrich, Len Schaper, University of Arkansas, HiDEC

Reliability Results for Polymeric Materials used in Passivation of Integrated Passive Devices
Brian Arbuckle, Don Bolton, Sunil Wijeyesekera, James Young, Intarsia Corporation

Self-consistent Model for Dielectric Constant Prediction of Polymer-ceramic Composite
Yang Rao, Jianmin Qu, C.P. Wong, Georgia Institute of Technology; Tom Marinis, Draper Laboratory

Lunch: 12:30 pm - 1:30 pm
Session 3:
Underfill
1:30pm – 3:35pm
Session Chairs:
Daniel Baldwin, Georgia Institute of Technology
Ray Pearson, Lehigh University

Experimental and Numerical Reliability Investigations of FCOB Assemblies with Process-Induced Defects
A. Schubert, R. Dudek, J. Kloeser, B. Michel, H. Reichl, Fraunhofer Institute for Reliability and Microintegration IZM

An Evaluation of Two Underfill Materials used in a Flip Chip CSP
R. Berriche, Intersil Corporation

Characterization of the Properties of the Bisphenol A and Bisphenol F Epoxies Cured by Imidazole Derivatized Curing Agents for Flip-Chip Underfill Applications
S.H. Shi, T. Yamashita and C.P. Wong, Georgia Institute of Technology

Material Challenges for Wafer-Level Underfills
Bodan Ma, Eric Zhang, Sun Hee Hong, Quinn K. Tong, Anna Savoca, National Starch and Chemical Company

Adhesion Characterization of No Flow Underfill Baselined with Fast Flow Snap Cure
Jicun Lu, Brian Smith, Daniel F. Baldwin, Georgia Institute of Technology

Break: 3:35 pm - 3:55 pm

Session 4:
Encapsulation
3:55pm – 6 pm
Session Chairs:
Ken Gilleo, Alpha Metals/Cookson
S.H. Shi, Georgia Institute of Technology

Adhesion Studies of Polyimide – Epoxy Interfaces in Flip Chip Assemblies
Raymond A. Pearson, Thomas B. Lloyd, Lehigh University

Optimization of the Dispensing Process for Reflowable Encapsulants in Flip Chip Assembly
P. Chouta, S. Davey, D.L. Santos, Binghamton University

A Novel Epoxy Encapsulant for CSP (µBGA®) - New Hydrophobic Epoxy Elastomer
Frank Y. Xu, Ph.D., Richard Bymark, 3M Company; Bin-Lin Hsu, Ph.D., Tessera, Inc.

Evaluation of Environmental Protection of Photo BCB Polymers (Cyclotene 40XX)
Jaili Wu, CP Wong, Georgia Institute of Technology; Dan Scheck, Phil Garrou, The Dow Chemical Co.

Novel Single Pass Reflow Encapsulant for Flip Chip Application
Hui Wang, Torey Tomaso, Xin Lin and Jennifer Allen, Kester Solder - Litton

Exhibits Open
3 pm - 8 pm

Welcome Reception in Exhibit Hall
6:30 pm - 8 pm
Tuesday, March 7

Session 5:
Flip Chip Bumping
8am – 10:05am
Session Chairs:
Kenneth Williams, MCNC
Rolf Aschenbrenner, Fraunhofer Institute

Qualification of the System Electroless Nickel Bumps and PbSn5 for High Temperature Applications
Sabine Anhóck, Andreas Ostmann, Technical University of Berlin; Rolf Aschenbrenner, Herbert Reichl, Fraunhofer Institute for Reliability and Microintegration

Break Through Developments on Electroless Nickel/Gold Plating on Copper Based Semiconductors
Andrew J.G. Strandjord, Scott F. Popelar, Curt A. Erickson, IC Interconnect

Numerical Investigation on the Influence of Different Substrate Materials on the Viscoplastic Behaviour of Flip Chip Solder Bumps
A. Eberle, R. Sievert and W. A. Schiller, Federal Institute for Materials Research and Testing (BAM), Berlin, Germany

Issues with Fine Pitch Bumping and Assembly
Sundeep Nangalia, Salvatore Bonafede, Alan Huffman, Chad Statler and Philip Deane, MCNC

Alternate Solder Bump Technologies for Flip Chip Applications
Li Li, Motorola Inc.

Break: 10:05 am - 10:25 am
Session 6:
Solder
10:25am – 12:30pm
Session Chairs:
Andrew Strandjord, IC Interconnect
Rajen Chanchani, Sandia National Laboratory

Formation of the Ni3Sn4 at the Boundary between Sn-Pb Solders and Au/Ni Plating
Akira Maeda, Toshio Umemura, Qiang Wu, Yoshihiro Tomita, Mitsubishi Electric Co.; Takeshi Abe, Fukuryo Semiconductor Engineering Co.

Formation, distribution and failure effects of voids in vapor-phase soldered small solder volumes
M. Beschorner, J. Villain, University of Applied Sciences Augsburg; H. J. Hacke, B. Brabetz, J. Zapf, Siemens AG

Characterization of Mechanical Properties of Bulk Lead Free Solders
Li Xiao, Johan Liu, Chalmers University of Technology

Effect of Thermal Aging on the Shear Strength of Lead-Free Solders
James Oliver, Zonghe Lai, Chalmers University of Technology/IVF; Johan Liu, Chalmers Univeristy of Technology

Flip Chip Self-alignment Mechanism and Modeling
Ruijun Chen, Brett Fennell, Daniel F. Baldwin, Georgia Institute of Technology

Lunch in the Exhibit Hall
12:30 pm - 1:30 pm

Exhibit Open
9:30 am - 7 pm

Posters in Exhibit Hall
3 pm - 7 pm
Session 7:
Flip Chip
1:30am – 3:35pm
Session Chairs:
Jianmin Qu, Georgia Institute of Technology
Li Li, Motorola

Reworkable No-Flow Underfills for Flip Chip Applications
Lejun Wang, Haiying Li, C.P. Wong, Georgia Institute of Technology

Flip Chip on Board (FCOB): Solderability, Reliability and the Role of Surface Finish
Weiping Li, Harold Fields and Richard Parker, Delphi-Delco Electronics Systems

Wafer Scale Packaging Based on Underfill Applied at the Wafer Level for Low-Cost Flip Chip Processing
C. Dustin Johnson, Stephen Busch, Daniel F. Baldwin, Ph.D., Georgia Institute of Technology

Effects of No-Clean Flux Residue on the Performance of Flip-Chip Devices
Michael Todd, Dexter Electronic Materials

Effect of Coupling Agents on Underfill Material in Flip Chip Packaging
Shijian Luo, C.P. Wong, Georgia Institute of Technology

Break: 3:35 pm - 3:55 pm
Session 8:
Chip Scale Packages
3:55pm - 6pm
Session Chairs:
Michael Toepper, TUB/Fraunhofer IZM
Peter Elenius, Flip Chip Technologies

Wafer Level Package using Double Solder Balls
Michael Toepper, TUB/Fraunhofer IZM

Mechanism of Underfill Cracking in Flip Chip BGA Package
J.B. Shim, E.C. Ahn, T.J. Cho, H.J. Moon, T.G. Chung, H.K. Yun, S.Y. Kang, S.Y. Oh, Samsung Electronics Co., Ltd.

3D Wafer Level Packaging
Sergey Savastiouk, Oleg Siniaguine, Ed Korczynski, Tru-Si Technologies

A Parametric Study of the Effects of Process Parameters on the Assembly of Chip Scale Packages
T. A. Nguty, B. Salam, and N. N. Ekere, University of Salford

Ultra CSP - Bump on Polymer Structure
H. Yang, Flip Chip Technologies
Poster Papers
3pm - 7pm
Session Chair:
C.P. Wong, Georgia Institute of Technology

Reworkable Underfills for Flip Chip, BGA, and CSP Applications
Lejun Wang, Ray Kang, Kaiying Li, Dan Baldwin, C.P. Wong, Georgia Institute of Technology

Study on the Correlation of Flip-Chip Reliability with Mechanical Properties of No-Flow Underfill Materials
S.H. Shi, Q.Z. Yao, J.M. Qu, C.P. Wong, Georgia Institute of Technology

Development of No-Flow Underfill Materials for High Lead Solder Bumped Flip-Chip Applications
S.H. Shi, Z.Q. Zhang, C.P. Wong, Georgia Institute of Technology

Development of New Reworkable Epoxy Resins for Flip Chip Underfill Applications
Haiying Li, Lejun Wang, C.P. Wong, Georgia Institute of Technology

Spray-Formed Silicon-Aluminum: A New Light-Weight Electronic Packaging Solution
David M. Jacobson, Electronic Materials Consultant; Andrew J.W. Ogilvy, Osprey Metals Ltd.

Development of Novel Composite Bonding Wires for Harsh Environments
Ulrich Draugelates, ISAF Technical University of Clausthal; Jurgen Wilde, University of Freiburg

Incorporation of Inorganic Filler into the No-Flow Underfill Material for Flip-Chip Application
Lianhua Fan and CP Wong, Georgia Institute of Technology

Effects of Curing Agents on the Properties of Electrically Conductive Adhesives
Daoqiang Lu, C.P. Wong, Georgia Institute of Technology

Wafer Level Batch Packaging Incorporation of Porous Gaps in a Polyimide Matrix using a Low Modulus Sacrificial Commercial Polymer
J. Williamson, C.P. Wong, Georgia Tech

Surface Tension Study of Substrates in Electronic Packaging
Shijian Luo, Mike Vidal, C.P. Wong, Georgia Institute of Technology

Low Temperature and Low Stress Reworkable Adhesives for MCM
Jiali Wu, C.P. Wong, Georgia Institute of Technology

Electrical Characterizations and Considerations of Electrical Conductive Adhesives (ECAs)
Y. Shimada, Hitachi Research Lab; D. Lu, C.P. Wong, Georgia Institute of Technology

Investigation on Effect of Carbon Black and Polymer Matrix on Conductive Polymer Composites with Positive Temperature Coefficient
Shijian Luo, C.P. Wong, Georgia Institute of Technology
Wednesday, March 8

Session 9:
High Density Substrates
8am - 10:05 am
Session Chairs:
Petri Savolainen, Nokia-Japan Co., Ltd.
Andreas Schubert, Fraunhofer Institute

High Density Substrate for Semiconductor Packages using Newly Developed Low CTE Build-up Material
Atsushi Takahashi, Hitachi Chemical Co., Ltd.

Halogen-free Materials for PWB and Advanced Package Substrate
Ken Ikeda, Hitachi Chemical Co., America, Ltd.

Next Generation ALIVH® Substrate for Bare LSI Chip Direct Mounting
Daizo Andoh, Tousaku Nishiyama, Tadashi Nakamura, Kazuo Eda, Masahide Tsukamoto, Matsushita Electric Industrial Co., Ltd.

Comparison of various Micro Via Technology
Toshio Nishiwaki, Ibiden Co., Ltd.

Development of Super Fine Pattern PWB MOSAIC
Nobuo Komatsu, Kazuhiro Shimizu, Sony Neagari Corp; Soichiro Kishimoto, Hiroyuki Hishinuma, Sony Chemicals Corp.

Break: 10:05 am - 10:25 am
Session 10:
Thermomechanics
10:25am – 12:30pm
Session Chair:
Suresh Sitaraman, Georgia Institute of Technology

Hygroscopic Behavior and In-Line Thermo-Mechanical Treatment of Polymeric Material on PBGA Warpage
Jim C.L. Wu, Morris Liang, Alex Lee, G.Y. Hung, J.J. Lee, Advanced Semiconductor Engineering, Inc.

Interface Design and Thermal Stresses in Layered Microelectronic Assemblies
Thomas Siegmund, Purdue University

Cure Kinetics Modeling of ViaLux™ 81: A Novel Epoxy Photo-Dielectric Dry Film (PDDF) for Microvia Applications
Rajiv C. Dunne, Suresh K. Sitaraman, Shijian Luo, C.P. Wong, Georgia Tech; William E. Estes, Mookan Periyasamy, DuPont Photopolymers and Electronic Materials

BGA and C4 Fatigue Dependence on Thermal Cycle Frequency
Giulio Di Giacomo & Umar Ahmad, IBM Microelectronics

Application of Phase-Change Materials in Pentium® II and Pentium® II Xeon™ Processor Cartridges
Chia-Pin Chiu, Gary L. Solbrekken, Vassou LeBonheur and Youzhi Xu, Intel Corporation