3rd International Academic Conference on Next Generation Packaging Research and Education
MARCH 8-10, 2000
Georgia Tech, Atlanta, Georgia, USA
PURPOSE OF THE CONFERENCE
The purpose of the conference is to make the academic community aware of all the significant advances made worldwide in both next generation electronic packaging research and education. In addition one of the goals of this conference is to promote international collaborations in areas of mutual interest to serve the global technical community better.
OUTCOMES OF THE LAST CONFERENCE (MARCH 99)
Forty-six faculty and researchers attended the 2nd International Academic Conference held at Georgia Tech. Thirteen of the attendees were international from countries such as Sweden, Taiwan, Hungary, United Kingdom, Canada, Korea, Germany, Japan, and Hong Kong. A total of 33 papers were presented in 10 sessions. In addition, there were two keynote speakers: Marshall Lih from NSF and David Topham from Electronics Manufacturing Engineering Research Network in the U.K. Majority of the sessions were dedicated to microelectronic packaging education presentations that spanned from pre-college education to industry education.
The conference ended with an open discussion session on the outcomes of the Conference. The following points were agreed upon by a majority of the participants:
**The International Academic Conferences should continue to be held periodically -preferably every year.
**Both packaging education and research should continue to be covered but on different days. More emphasis should be put on education and only recent developments in research should be included.
**Global collaborations should be strengthened no matter how difficult and challenging that it may be.
**Georgia Tech’s PRC has developed several microelectronic packaging courses over the last five years. These courses should be presented in the coming Academic Conference.
In addition to the points above, other topics that were recommended to be covered during the education sessions at the 3rd International Academic Conference are:
**Integration of research & education.
**Pre-college education.
**Internship programs (both industry & student perspective).
**Assessment of educational programs.

3rd INTERNATIONAL CONFERENCE FOCUS (MARCH 8-10, 2000)
The 3rd International Academic Conference will be held on March 8-10, 2000 at Georgia Tech following the International Flip-chip Workshop (March 3-5,2000) and International Conference on Advanced Packaging Materials (March 6-8, 2000). The latter two conferences will be held nearby, at the beautiful Chateau Elan Resort (50 miles North of Atlanta). The 3rd International Academic Conference will have the following education and research sessions:
Education Sessions:
**Microelectronics packaging undergraduate education programs and curriculum
**Microelectronics packaging graduate education programs
**Novel internship programs
**Continuing education programs including web-based courses
**Pre-college programs
**Panel Discussion: Education Needs, Programs &
Collaborations
Research Sessions:
**Invited talks on SOP vs SOC
**MEMS packaging
**Global collaboration in "Green Packaging": What should be
its focus and how to fund it globally in Europe, Asia
and North America
**Panel Discussion: Future Needs & Effective Global
Collaborations
Submit
Please submit a title for either Research or Education sessions by January 5 to [Leyla.conrad@ee.gatech.edu]. The abstract is due by February 1, 2000. The program will be finalized by February 15, 2000.
We are all looking forward to seeing you all next year here at Georgia Tech. – Rao Tummala