Vice President Rao Tummala
Announces Changes in TCs
Technical VP Rao Tummala in his efforts to continue to upgrade the CPMT’s technical strategy announced two changes in the leadership of two technical committees and plans to create a new technical committee.
The new TC chair for TC-3 will be Prof. Dan ?Baldwin of Georgia Institute of Technology who is currently the General Chair of International Advanced Technology Workshop on flipchip Technology. TC-3 has been redirected to address area array assembly, both at the IC and the Package levels.
He also announced that Dr. Walt Trybula will head up TC-8 emphasizing Package Manufacturing and interfacing with our Society premiere manufacturing conference, IEMT.
The Technical VP believes that a global society like CPMT must have a TC to address environmental concerns from design to disposal of electronic products. Thus TC-21, Green Electronics Manufacturing and Packaging, is now chaired by Hansjorg Griese. – submitted by Rao Tummala