Announces Changes in TCs
Technical VP Rao Tummala in his efforts to continue to upgrade
the CPMTs technical strategy announced two changes in the
leadership of two technical committees and plans to create a new
The new TC chair for TC-3 will be Prof. Dan ?Baldwin of Georgia
Institute of Technology who is currently the General Chair of
International Advanced Technology Workshop on flipchip Technology.
TC-3 has been redirected to address area array assembly, both
at the IC and the Package levels.
He also announced that Dr. Walt Trybula will head up TC-8 emphasizing
Package Manufacturing and interfacing with our Society premiere
manufacturing conference, IEMT.
The Technical VP believes that a global society like CPMT must
have a TC to address environmental concerns from design to disposal
of electronic products. Thus TC-21, Green Electronics Manufacturing
and Packaging, is now chaired by Hansjorg Griese.
submitted by Rao Tummala