Call For Papers

12th Symposium on Mechanics of SMT Assemblies and Photonics Structures

part of International mechancial Engineering Congress and Exposition

Walt Disney World Dolphin, Orlando, Florida

November 5 - 10, 2000

Surface-Mount Assemblies

* Wafer level packaging and interconnection and interconnection

* Sequenctial build-up printed circuit boards

* Microvias

* Chip scale package and ball-grid array assemblies

* Flip-chip package assemblies

* Underfill incapsulants

* Adhesives and adhesively bonded points

* Solders and solder joints

 

Photonics Structures

* Causes of materials, structural, and product failures

* Advanced experimental techniques, experimental evaluations and reliability testing

* Qualification schemes and testing techniques, approaches and standards in photonics engineering

* Natural and superimposed environmental stress effects and testing

* Accelerated factors and accelerated testing in photonics engineering

* Thermal phenomena and thermal stress failures in photonics systems

* Mechanics, physics and processing of materials for photonics applications

* Interfacial phenomena, and adhesively bonded and soldered joints in photonics

* Laser welding for photonics applications

* Effect of creep and stress relaxation on the optical performance of photonics devices

* Reliability issues in photonics engineering

* Dynamic response of optoelectronics and photonics structures to shocks and vibrations

* Predictive modeling in optoelectronics and photonics engineering

* Prediction and optimization of the reliability of photonics materials, structures, packages and systems.

 

Submit abstracts by March 31, 2000 -- call first if later than this date.

 

John H. Lau, Express Packaging Systems, Inc., 1137-B San Antonio Road, Palo Alto, CA 94303, Tel 650-919-0300, lau@epswin.com

 

Ephraim Suhir, Lucent Technologies, Inc., 600 Mountain Ave., Room 1D-443, Murray Hill, NJ 07974, tel 908-582-5301, suhir@lucent.com