Electronic Materials and Packaging
(EMAP2000)
November 30 - December 2, 2000
Hong Kong University of Science & Technology
Call For Papers and Participation
You are invited to submit a paper for the EMAP2000. The EMAP2000 symposium is organized by the Hong Kong Univer-sity of Science & Technology in collaboration with Nanyang Technological University, Singapore and the City University of Hong Kong. It is jointly sponsored by the IEEE Component, Packaging and Manufacturing Technology (CPMT) Hong Kong Chapter, the ASME Hong Kong Section, Croucher Foundation and the Institute of Materials Research & Engineering (IMRE), Singapore. The objective of this symposium is to create an inter-national forum for the exchange, dissemination and discussion of state-of-the-art technologies and recent developments in elec-tronic materials, packaging and assembly. Following the tre-mendous success in the first conference in Singapore, which was attended by delegates from 10 major countries, the second sym-posium will be held in Hong Kong, the Pearl of the Orient. It will be the first major conference on electronic materials and packaging ever to be held in this city. Meet world-renowned authorities from the Asia-Pacific region, USA and Europe. Join us and get in touch with leading-edge technologies, and find out more about Hong Kong’s and South China’s electronic packag-ing industries. In addition, short courses on current packaging trends and technological issues will be offered. Papers are in-vited from industry participants as well as researchers from the academia and government organizations.

Major Topics of Symposium
**Advanced Electronic Packaging Technologies: Wafer Level Packaging, FC, CSP, DCA, MCM
**Packaging Materials and Processes: Lead-free Solders, Adhe-sives, Underfills, Encapsulants, PCBs
**Interconnect Technologies: Wirebonding, Fine Pitch, Mi-crovia, Build-up Technologies
**Materials Characterisation, Testing and Measurements: Elec-trical, Thermal, Chemical, Mechanical
**Package Design, Modeling and Simulation
**Reliability and Failure Analysis: Interfacial Phenomena, De-lamination, Moisture effects ( MEMS Packaging
**Polymers and Ceramics for Electronic Applications, Thin films/coatings, Metallisation
Abstracts and Papers
A one-page abstract should be submitted to the Secretariat of Symposium, describing the scope, contents and key points of the proposed paper. Instructions for preparing the full paper will be sent to the authors whose abstracts are accepted after review.
Participants will be required to register upon notification of acceptance of their full papers. The registration fee is US$350 before October 15, 2000, or US$380 if paid afterwards. Re-duced fees are applicable for students and bulk registrations (more than ten) from the same institution/company. The regis-tration fee will cover the abstract book, lunches, morning and afternoon refreshments, a reception and a banquet. Exhibitions will be arranged and the details will be announced later.
Important Date: July 31, 2000 Abstract submission
More information at home page: http://www.ust.hk/emap2000 Executive Committee Chair: MMF Yuen (HKUST)

(Editor deleted this announcement in last minute downsize of Paper Newsletter -- my mistake)