Print out the full Call for Papers (.doc; dated June 2000).
You are invited to submit a paper on a current unpublished work in the areas below. The list is not exhaustive and is intended to give an indication of the scope and character of the conference:
CONFERENCE TOPICS
1. Advanced Packaging: single chip, multi-chip, leadframe based,
substrate based, wafer level, micro-electro-mechanical systems
(MEMS)
2. Interconnection Technologies: flip-chip, bump formation, anisotropic
interconnections, fine pitch interconnections, Cu interconnections,
wire bonding, soldering
3. Materials and Processes: Pb free solders, encapsulants, underfills,
die attach, testing and characterisation techniques
4. Substrate Technologies: flex, high density substrates, PWB,
microvias, build-up technologies, LTCC, embedded passives
5. Packaging Reliability: component, board level, adhesion enhancement,
accelerated, modelling, failure analysis, repair and rework
6. Thermomechanical Modelling and Simulation: delamination, fracture,
fatigue, moisture, reliability modelling
7. Electrical Design & Analysis: signal integrity and noise
(coupling, reflection and switching), analysis in packages and
interconnects, high frequency characterisation of packages and
interconnects, power distribution in multilayer packaging, radiated
emissions
8. Thermal Design & Analysis: thermal simulation and measurements
for packages, compact modeling, system level thermal management
and cooling techniques
9. Assembly and Manufacturing Technologies: assembly and processes,
cleaning, yield improvements, cycle-time reduction
10. Trends and Strategies: Packaging technology, systems, business,
market
PAPER RECOGNITION
The Conference proceeding is an official IEEE publication. Selected
papers presented in at the Conference will be considered for publication
in the IEEE Transactions of the CPMT.
ABSTRACT SUBMISSION / IMPORTANT DATES
To submit a paper, send an abstract of about 300 words clearly
describing the nature, scope, content and significance of a previously
unpublished work. Important figures may be included. Submissions
with your name, affiliation, contact and email may be made by
email or fax to:
Dr T B Lim
General Chairman
Institute Of Microelectronics
Email: tblim@ime.org.sg
Fax: (65) 774 5747
Submission of Abstract: 20 June 2000
ABOUT THE EPTC '2000
ORGANISED BY: IEEE RELIABILITY/CPMT/ED Singapore Chapter
TECHNICALLY CO-SPONSORED BY: IEEE CPMT SOCIETY
IN COOPERATION: ASME, IMAPS, Centre for IC Failure Analysis &
Reliability, Gintic Institute of Manufacturing Technology, Institute
of Materials Research & Engineering, Institute of Microelectronics,
Nanyang Technological University, National University of Singapore