Advanced Packaging Materials
The 6th Advanced Packaging Materials Symposium -- co-sponsored by IEEE CPMT, IMAPS and Georgia Tech PRC --was held in Braselton, GA (60 miles north from Atlanta Airport) with over 200 attendees. In addition, 31 attended the PDC short course on Polymers for Electronics. The attendees were from industries, academia and government labs. There were 10 sessions and 16 poster papers and 11exhibitors. There were lots good discussion and sunny weather for the 2.5 days meeting. The General Chair was C. P. Wong, Program Chairs were Jim Morris and Phil Garrou.
Submitted by CP Wong