UPCOMING MEETINGS
6th International Symposium on Advanced Packaging Materials, Braselton GA March 6-8, 2000
Contact 1-888-GO-IMAPS http://www.imaps.org

Semiconductor Thermal Measurement & Management Symposium, SEMI-THERM
San Jose CA March 21-23, 2000
Contact: Paul Baltes mailto:epd@engr.arizona.edu
(520)621-3054, fax: (520)621-1443, http://thermengr.com

2000 IEMT/IMC Symposium, Omiya, Japan,April 19-21, 2000
Contact: mailto:IMAPS@ruby.famille.ne.jp
+81-3-5310-2010 Fax: +81-3-5310-211
http://www3.ruby.famille.ne.jp/~jiep/00sympo/00sympo.html

2000 European VLSI Packaging & Microsystems Packaging Techniques & Manufacturing Technologies Workshop
Cork, Ireland May 8-9, 2000
Contact: Rolf Aschenbrenner, FhG IZM, Gustav Meyer Allee 25, 13355 Berlin, Germany, mailto:aschenbr@izm.fhg.de

Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS
(Confer. CAD, Design & Test/Confer. Microfabrication, Integration & Packaging), Paris, France; May 9-11, 2000
Contact: Bernard Courtois, mailto:Bernard.Courtois@imag.fr
+33-4-76-57-46-15 Fax: +33-4-76-47-38-14

50th Electronic Component & Technology Conference
Las Vegas NV May 21-24, 2000
Contact: Mike McShane mailto:rdld50@email.sps.mot.com
(512)933-6403, Fax: (512)933-5844, http://www.ectc.net

I-THERM 2000, Las Vegas NV, May 23-25(?), 2000
Contact: Paul Baltes mailto:epd@engr.arizona.edu
(520)621-5104 fax: (520)621-1443

4th International Conference on Adhesive Joining and
Coating Technology in Electronic Manufacturing
Helsinki, Finland June 18-21, 2000
Contact: Jorma Kivilahti, mailto:jorma.kivilahti@hut.fi
Pia Holmberg mailto:pia.holmberg@hut.fi
+358-9-628-044 Fax: +358-9-667-675
http://www.ept.hut.fi/AD2000

2nd International Workshop on Integrated Power Packaging
Boston MA July, 2000
Contact: Doug Hopkins mailto:d.hopkins@ieee.org

25th International Electronics Manufacturing Technology (IEMT) Symposium
Santa Clara, California, USA October 2-3, 2000
Web site from: http://www.semi.org

12th Symposium on Mechanics of SMT Assemblies and Photonics Structures
Walt Disney World, Florida November 5-10, 2000
contact: John Lau at lau@epswin.com

5th VLSI Packaging Workshop of Japan
Kyoto, Japan December 4-6, 2000
Contact: Fuminori Ishitsuka mailto:ishi@atsugi.ntt-at.co.jp
+81-46-240-4053 Fax: +81-46-247-8431
George Harman, mailto:george.harman@nist.gov
(301)975-2097 Fax: (301)948-4081

3rd Electronics Packaging Technology Conference (EPTC’2000), Singapore, December 5-7, 2000
Contact: T. B. Lim mailto:tblim@ime.org.sg http://cicfar.ee.nus.sg/eptc.html