OFFICERS & BOARD OF GOVERNORS
President-- Rao Tummala, 1 404 894 9097
Tech VP—Phil Garrou, 1 919 248 9261
Admin VP--H. Anthony Chan, 1 732 957 6754
Treasurer--L. Merrill Palmer, 1 619 675 2889
VP Publication--Paul B. Wesling,1 408 285 9555
VP Conferences--James Morris, 1 607 777 4774
VP Education--Albert Puttlitz, FAX 802 879 0466
Sr. Past President-- Ralph Wyndrum, 732 420 2400
Jr. Past President—John Stafford, 1 602 413 5509
Secretary--Ron Gedney, 1 703 834 2084
Executive Director-- Marsha Tickman,
1 732 562 5529
Elected Members at Large
2001
Corey A. Koehler
Michael Lebby
Kanji Otsuka
Leonard W. Schaper
Connie Swager
Elke Zakel
2000
William Chen
Craig Gaw
Tony W. C. Mak
Larry Mann
John Segelken
C. P. Wong
2002
Alina Deutsch
Koji Nihei
James Steele Jr.
Ephraim Suhir
Walt Trybula
E. Jan Vardaman

Standing Committee Chairpeople
Academic Affairs--Olgierd Palusinski
Educational Activities--
Distinguished Speakers-- A. F. Puttlitz
Fellows Search--Rao Tummala
Fellows--George G. Harman
Constitution & Bylaws--David W. Palmer
Finance--Ralph Wyndrum, Jr.
Long Range Planning--Dennis Olsen
Standards Chair - "Jack" Balde. 908 788 5190
Circuits and Devices magazine Editor—
Joe Brewer, 904 445 8971
Membership--Ralph Russell, email:
cpmt-membership@ieee.org
Chapter Development--R. W. Russell, II,
cpmt-membership@ieee.org
Nominations--John Segelken, 1 803 939 2333
International Relations-- Leo Feinstein, 508 870 0051; Europe=Ephraim
Suhir, 908 582 5301; Far East= W. T. Chen, 65 874 8110
Publicity--
Joint Committee on Semiconductor Manufacturing--G. C. Cheek

Technical Committee Chairpeople
TC-1 Electrical Contacts, Connectors and Cables--
Gerald Witter, 847 244 6025
TC-2 Discrete and Integral Passive Components—Tim Lenihan,
TC-3 IC and Package Assembly – Dan Baldwin, 602 413
TC-4 Manufacturing Design & Process—Walt Trybula, 512 356 3306
TC-5 Materials--Rajen Chanchani, 505 844 3482
TC-6 High Density Board Packaging--Connie Swager, 954 958 6916
TC-7 Environmental Stress & Reliability Test--Joseph Mantz, 425 702 2709
TC-8 Semiconductor Processing & Manufacturing--John Reekstin,
714 762 5077: Court Skinner, 408 453 9460
TC-9 Thermal Management & Thermomechanical Design--
Tony Mak, 508 853 5000
TC-10 Fiber Optics & Photonics—Bill Sherry, 609 538 1800 X126
TC-11 Electrical Test -- David Keezer, 404 894 4741
TC-12 Electrical Design, Modeling and Simulation--
Madhavan Swaminathan, 404 894 3340
TC-13 Power Electronics Packaging--Doug Hopkins, 607 729 9949
TC-14 Systems Packaging—Lisa Pallotti
TC-15 New Technology Directions--Ephrain Suhir, 908 582 5301
TC-16 RF and Wireless-- Craig Gaw, 602 413 5920
TC-17 MEMS and Sensor Packaging-- Karen Markus, 919 248 1437
TC-18 Wafer Level Packaging—Luu Nguyen, 1 408 721 4786
TC-19 Education--Rao Tummala, 404 894 9097
TC-20 Bio-Electronics Packaging, Robert Hubbard, 602 929 5488
TC-21 Green Electronics Manufacturing and Packaging, Hansjoerg Griese
TC-22 Contract Manufacturing

Representatives
ABET Ad Hoc Visitors--W. Arthur Porter
ECTC Coordinating Committee--C. P. Wong, 404 894 8391
IEEE Press Liaison--Joe Brewer, 904 445 8971
Intersociety Liaison--W. T. Chen, 65 874 8110
IMAPS--Phil Garrou, 919 248 9261
ASME--Ephraim Suhir, 908 582 5301, suhir@hogpa.att.com
AVS--James Morris, 1 607 777 4774
Solid State Circuits Council--Leslie J. Palkuti
U. S. A. Pace Coordinator-- R. W. Wyndrum, Jr.

TRANSACTION EDITORS:
Avram Bar-Cohen, editor Part A
University. of Minnesota
111 Church St SE, ME Dept
Minneapolis, MN 55455
612 626 7244, Fax 612 624 1398

Peter Krusius, editor Part B
EE Department, Cornell University .
607 255 3401, fax 607 255 4777

Walter Trybula, editor Part C
512 356 3306, w.trybula@ieee.org