IEEE
FIRST CALL FOR PAPERS
THIRD INTERNATIONAL
WORKSHOP ON SMART Card Technologies AND APPLICATIONS
TECHNICAL COMMITTEE
Mike Campbell, BPA Ltd. (GB) ( Subash Khadpe, Semiconductor Technology
Center, Inc. (USA) ( Richard Scheuenpflug, Siemens AG (D) ( Dr.
Ephraim Suhir, Lucent Technologies (USA) ( Dr. Werner Wilke, VDI/VDE
(D) ( Stephen Wong, Gintic Institute of Manufacturing Technology,
Singapore ( Jean - Pierre Gloton, Gemplus Electronics (F)
The Organizer
The German Chapter of IEEE – CPMT (Components, Packaging
and Manufacturing Technology) Society is organizing a conference
on flip chip and ball grid array packaging technologies. The
conference will be conducted in single, sequential sessions so
that attendees will be able to hear every paper. Most papers will
be 30 minutes long with time for questions and discussions.
Abstracts
Authors are invited to submit papers describing recent work. Papers
may be extended abstracts or full papers. In either case, clearly
describe the nature of the work, explain its significance and
highlight novel features. On the title page, please indicate title,
name and affiliation of all authors, an abstract of 100 words
and suggested topics. Also identify a contact author
and include a complete mailing address, e - mail address, phone
and fax number.
Abstracts must be received by August, 31, 2000. Authors will
be notified of paper acceptance by mid of September, 2000. The
extended abstracts supplemented with up to four of your most important
figures or full papers have to be submitted by October, 15, 2000
and will be implemented in a conference handout which will be
given to all attendees.
Subjects:
*Smart Card Trends, Developments, Applications and Markets
*Packaging for Smart Cards
*Contact Cards, Contactless Cards, Combi Cards
*Chip Assembly – Wire Bond, Flip Chip, Embedding
*Equipment and Materials
*Reliability of Smart Cards
*Associated Applications, Transducers, Smart Tags
Future Trends and Markets
EXHIBITS
The conference is interested in corporate sponsors and technical
exhibits relating to the theme of the conference. A vendors reception
will be held during the conference. The list of exhibitors and
sponsors will be included in the final program. Companies which
are interested in the participation of the exhibition
should contact Ms. Evelyn Erlebach,
Phone + 49 (0) 30 46 78 15 – 55,
Fax + 49 (0) 30 46 78 15 – 51.
Organizer
IEEE CPMT German Chapter
Conference Chair
Dr. Elke Zakel, PacTech GmbH (D)
INTERNATIONAL ADVISORY COMMITTEE
Ralph W. Wyndrum, AT&T Bell Labs, (USA)
Koji Nihei, Waseda University (JP)
Please, send abstracts to following address:
Dr. Elke Zakel
IEEE - CPMT - German Chapter
Gustav-Meyer-Allee 25
Building 12, Entrance 1a
D - 13355 Berlin, Germany
Phone + 49 30 467 815 – 55 Fax + 49 30 467 815 - 51
Email: elke.zakel@ieee.org
Internet: http://www.pactech.de/CPMT-Germany