CPMT Society Awards
The purpose of the CPMT Society Awards is to recognize and promote outstanding contributions to the fields encompassed by the society through technical innovation and technology management. As the Society has grown, the number and diversity of the awards have been increased to recognize wider spectrum of fields and contributors, including younger generation. CPMT is a global society and all CPMT awards are global. In coming years, increasing efforts will be made to make the Society members in US and abroad aware of these awards through several publicity programs. This will honor our members and broadcast the CPMT Society’s vision.
Efforts will also be undertaken to encourage all members to attain the highest grade of membership for which they qualify. Many members have the credentials for Senior Member Grade but are unaware of the requirements and/or the process for attaining this. Outreach efforts will be employed to publicize this information. Additionally, the identification and nomination of potential candidates for IEEE Fellow, the highest grade of membership, will be pursued more aggressively.

Service Award
David Feldman Contribution Award ($1000+Certificate)
John Lau (Year 2000) for service to various IEEE CPMT activities over the years and significant contributions to electronic packaging technology

Technical Contribution Awards

Outstanding Sustained Technical Contribution Award ($1000+Certificate)
Ephraim Suhir (Year 2000) for pioneering work in materials and mechanical engineering related to microelectronics and fiber-optics structures

CPMT Electronics Manufacturing Technology Award ($1000+Certificate)
Rama Shukla (Year 2000) for leadership and technical direction in the development and high yield manufacturing of flip chip packages using organic substrate technology for Intel's microprocessor family

Outstanding Young Engineer Award ($500+Certificate+1 year free membership in CPMT)
Matt Schwiebert (Year 2000) for significant contributions to the development and manufacturing of electronic packaging assembly processes and the Electronic Components and Technology Conference activities

Student Awards
Graduate Fellowship for Research on Electronic Packaging (Motorola). Awarded based on ECTC student presentations

Chapter Awards
CPMT Chapter of the Year Award

Best Paper Awards
Transactions on Components and Packaging Tech. Prize Paper Award ($1000+Certificate)
Transactions on Advanced Packaging Prize Paper Award
Transactions on Electronics Packaging Manufacturing Prize Paper Award
ECTC Best Paper Award ($1000+Certificate)
ECTC Best Poster Session Award

Fellows
IEEE Senior Member
IEEE Fellow

IEEE awards in CPMT technical Scope
Cledo Brunetti Award (electronics miniaturization)
David Sarnoff award for outstanding contribution leading to major commercialization

--Rao Bonda & John Segelken, May 2000