EPTC 2000 Call for Papers
3rd Electronics Packaging
Technology Conference
5 - 7 December 2000, Sheraton Towers, Singapore
Organised by:
IEEE Reliability / CPMT / ED Singapore Chapter
Technically Co-Sponsored by:
IEEE CPMT Society & IMAPS
In Cooperation With: ASME, Gintic Institute of Manufacturing
Technology, Institute of Materials Research and Engineering, Institute
of Microelectronics, Nanyang Technological University, National
University of Singapore.
ABOUT EPTC 2000
The EPTC is an international conference on the research, development,
and applications of technologies for electronic components, assemblies
and systems. Initiated in 1997 by the IEEE Reliability/CPMT/ED
Singapore Chapter, the EPTC is emerging as a major electronic
packaging conference in the South East Asian region where the
bulk of the world’s electronic packaging activities are taking
place. The 3rd in the series, the EPTC 2000 features technical
sessions, short courses, exhibitions and opportunities to meet
with the leading experts in the field.
Important Dates
30 June 2000 Submission of Abstracts
30 July 2000 Notification of Acceptance
30 Sept 2000 Submission of Manuscript
More about abstract submission: Email submission preferred. Fax submission may be made to Secretariat. Abstracts should describe nature, scope, content and significance of a previously unpublished work, and should bear name, address, telephone/fax and email address of the principal author.
Tutorials: Conference programme includes full-day tutorials by well known experts in their fields covering areas such as high density interconnect technologies and applications, next generation electronic products, package design and electrical challenges, and thermal management at component and system levels.
Exhibition: A commercial exhibition will be held in
conjunction with the conference, featuring exhibits from the suppliers
of materials, components, equipment, software and services to
the microelectronics and electronics assembly industries.
For exhibition information and bookings please contact the Secretariat.
Registration: Registration fees for tutorials and conference
will be specified in the next mailing.
CONFERENCE TOPICS
Papers should cover relevant topics in electronic packaging including
but not limited to:
1. Advanced Packaging: single chip, multi-chip, leadframe based,
substrate based, wafer level, MEMS
2. Interconnection Technologies: flip-chip, bump formation, anisotropic
/ fine pitch / Cu interconnections, wire bonding, soldering
3. Materials and Processes: Pb free solders, ubm, halogen free
materials, encapsulants, underfills, die attach, characterisation
techniques
4. Substrate Technologies: flex, high density substrates, PWB,
microvias, build-up technologies, LTCC, embedded passives
5. Packaging Reliability: component, board level, interfacial
adhesion, accelerated tests, modelling, failure analysis, rework
6. Thermomechanical Modelling & Simulation: delamination,
fracture, fatigue, moisture, reliability modelling
7. Electrical Design & Analysis: signal integrity & noise
(coupling, reflection & switching), HF characterisation, power
distribution, radiated emissions
8. Thermal Design & Analysis: thermal modelling, simulation
& measurements, system level thermal management & cooling
techniques
9. Assembly & Manufacturing Technologies: assembly and processes,
cleaning, yield improvements, cycle-time reduction
10. Trends & Strategies: Packaging technology, systems, business,
market
SELECTED PAPERS FOR IEEE TRANSACTIONS
The Conference Proceedings will be an official IEEE publication.
Selected papers presented at the Conference will be considered
for publication in the IEEE Transactions of CPMT.
SUBMISSION OF ABSTRACTS
You are invited to submit an abstract of about 300 words describing
the contents of your proposed paper. You may include a few important
figures. Abstracts should be submitted to one of the following:
T B Lim, General Chair, at tblim@ime.org.sg
Charles Lee, Tech Chair, at Charles.Lee@infineon.com
ORGANISING COMMITTEE
General Chair: TB Lim Institute of Microelectronics (IME)
Past Chair: Andrew Tay National University of Singapore
Finance Chair: YK Swee UTAC
Technical Chair: Charles Lee Infineon
Asst Tech Chair: KC Toh Nanyang Technological University
Members: Joseph Arokiam Honeywell
PK Chan DSO National Labs
Simon Chua Lucent
Klaus Dittmar American Fine Wire
Mahadevan Iyer IME
James How Motorola
K Sivakumar STMicroelectronics
S Lahiri Institute of Materials Research and Engineering (IMRE)
YC Mui AMD
Peter Pooh GES International
MK Radhakrishnan IME
DJ Xie Gintic Institute of Manufacturing Technology
INTERNATIONAL ADVISORY COMMITTEE
R Aschenbrenner Fraunhorfer IZM, Germany
Kingshuk Banerji Motorola, USA
William Chen CPMT/IMRE, Singapore
A Bar-Cohen U of Minnesota, USA
S Denda JIEP, Japan
CJM Lasance Philips, Netherlands
John Lau Express Packaging, USA
Ricky Lee HKUST, Hong Kong
Johan Liu Chalmers Uni, Sweden
Raj Master AMD, USA
KW Paik KAIST, Korea
M Pecht CALCE, Maryland, USA
E Suhir Lucent, USA
Rao Tummala Georgia Tech, USA
Robert Weinke Siemens, Germany
Paul Wesling IEEE, USA
EB Wu ITRI, Taiwan
SECRETARIAT Jasmine Leong Tel: (65) 743 2523 Fax: (65) 746 1095 Email: ept@pacific.net.sg