Call for Abstracts

OEP 2000

The 2nd IEEE Optoelectronics Packaging Workshop

4-6 October 2000

Coeur d' Alene Resort, Coeur d" alene, Idaho

OPTOELECTRONICS PACKAGING

Oral presentations and poster presentations are solicited on all topics pertaining to the design, development, and technology of assembling, packaging and manufacturing active/passive hybrid and integrated photonic components, devices and circuits.

Oral Presentation Session Topics:

**Discrete Component Technology (packages, lenses, silicon based optical devices [SiOB, Si-WG], TECs, fibers, connectors, integrated passives, WDM, etc.)

**Active Components: Fiber Amplifiers, Pump Lasers, High Speed Modulators, etc.

**Optical MEMS (device design, process technology), reliability, applications, etc.)

**Process and Assembly Package Integration: < 10 Gb/s Signaling Devices

**Process and Assembly Package Integration: > 40 Gb/s Signaling Devices

You are invited to submit a 250 word abstract via email as a PDF file including telephone number, FAX number, and e-mail address to:

IEEE LEOS Conferences

Tel: 1 732 562 3898

Email: oep@ieee.org

For information regarding poster presentation and post deadline submissions, registration and lodging, see our OEP2000 website at: http://www.ieee.org/leos/society

Abstracts Due: 15 August 2000

Randall Heyler, General Chairman, Newport, Tel: 949 253 1657, rheyler@newport.com

John Osenbach, Program Chairman, Lucent Technologies, Tel: 610 391 2370, osenbach@lucent.com

Werner Hunziker, Program Co-Chairman, Opto Speed SA, Tel: 41 1 633 2172, whunziker@optospeed.ch

Atsushi Takai, Program Co.Chairman, Hitachi Ltd., Tel: 81 45 865 7003, atsushi_takai@cm.tcd.hitachi.co.jp