WORKSHOPS in ELECTRONICS PACKAGING
Chalmers University of Technology in collaboration with
IEEE/CPMT Sweden Chapter, IVF, Gothenburg, Sweden

001 Life Cycle Analysis for Environmentally Compatible Electronics (0.5 day)
(Jun.15, 2000)
Anders Andrae, Ericsson Business Networks, Sweden
002 Processing of Die Attach Adhesives & Underfill Resins (1 day)
(Jun.16, 2000)
Raymond A. Pearson, Lehigh University, USA
003 Conductive Adhesives for Electronics Packaging (1.5 days)
(Jun.27-28/Aug.29-30/Oct.24-25/Dec.13-14, 2000)
Johan Liu, Chalmers University of Technology, Sweden
004 Polymers for Electronics Packaging (2 days)
(Aug.21-22, 2000)
C.P.Wong, Georgia Institute of Technology, USA
005 Substrate Based Semiconductor Packaging (1 day)
(Sep.8, 2000)
Charles E. Bauer, Techlead Corporation, USA
006 Flip Chip Application & Bumping Technologies (1 day)
(Sep.14/Nov.14, 2000)
Peter Elenius, Flip Chip Technologies, USA
007 Thermomechanical Reliability of Microelectronic Packages (1 day)
(Sep.15/Dec.7, 2000)
Jianmin Qu, Georgia Institute of Technology, USA
008 Anisotropically Conductive Adhesives for Flip Chip Applications (1 day)
(Oct, 3, 2000)
Johan Liu, Chalmers University of Technology, Sweden & Martin Böttcher, Delo GmbH, Germany
009 Lead Free Solders (1 day)
(Nov.7, 2000)
Johan Liu, Chalmers University of Technology, Sweden; Gordon C. Whitten, Delphi Delco
Electronics Systems, USA & Patrice Rollet, Dehon Group, France
010 Adhesion Science & Technology (2 days)
(Nov.9-10, 2000)
Kash Mittal, Consultant, former IBM senior staff, USA
011 Virtual Reliability Prediction for Electronics Packaging (1 day)
(Date to be advised), Sheng Liu, Wayne State University, USA
012 Conductive Adhesives, (Date to be advised), James Morris, State University of New York,
Binghamton, USA
013 ACA Joining Technology in Electronics Packaging (1 day),
(Date to be advised), Johan Liu, Chlamers University of Technology, Sweden & T. Sugiyama,
Sony Chemical
014 An Introduction to the Thermal Design of Electronic Products, (Sept.19, 2000/Feb, 2001),
David Whalley, Loughborough University, UK

Workshop Enquiries
Contact: Grace Zhou
Tel: 46-31-706-6229
Fax: 46-31-706-6244
Email: zhou@pe.chalmers.se

For details, please visit Http://www.pe.chalmers.se/org/elprod/