TC-12: Technical Committee on Electrical Design, Modeling, and Simulation Web-Site Update
TC-12 has updated its web site at http://www.ewh.ieee.org/soc/cpmt/tc12 to better serve the needs of its members and all the engineers who are CPMT society members and involved in packaging electrical design and analysis. The web masters are Moises Cases and Jaya Bandhyopadyay from IBM, Austin and great thanks go to Paul Wesling, VP for Publications, for posting all our updates.

TC-12 has 21 committee members with equal representation from industry and academia. Two members are from Asia, Singapore and Korea, and two from Europe, Belgium and Germany. Because of this well-balanced mix of representatives, the web site includes direct links to various university projects that the members represent from Cornell, Georgia Tech, SUNY Binghamton, U. of Arizona, U. of Arkansas, and U. of Illinois.
Each link connects directly to the school's web-page where engineers can find out about the latest research projects being pursued, how many students and faculty members are involved, when are experienced graduate students ready to graduate and possibly join one of the relevant companies in the field. This information facilitates cross-fertilization of research work and can initiate joint industry-university projects.
Another very useful feature that was added recently are links by subject to Publications:
This is intended to provide a database of reference publications by topics. The key topics that were identified are shown and the responsible TC members are as follows:
System design - M. Cases, G. Katopis, and R. Bracken
On-chip interconnections - A. Deutsch and H. Grabinski
Measurement and characterization - D. Williams, L. Martens
Power distribution - L. Smith, D. Becker, T. Roy
Simultaneous-switching noise - J. Libous, M. Swaminathan
Radiated emissions and coupling - M. Iyer, J. Kim
Microwave and RF packaging - R. Jackson, A. Weissharr
Accelerated modeling - A. Cangellaris, J. Prince

The database is providing a list of the latest publications that have appeared in technical journals, books, or conference proceedings. Both the journals and conferences cover a broad range of IEEE societies and the list will be updated twice a year. Such an up-to-date database is extremely useful for the IEEE members working in the topics listed, both in industry and in the universities. Once the titles of interest are found, the full-length papers can be found in the on-line database provided by the IEEE.

A sample section for on-chip interconnections is shown below:
*On-Chip Interconnect
B. Benschneider et al., "A 1 GHz Alpha Microprocessor", in Proc. Dig. 2000 IEEE International Solid-State Circuits Conference, San Francisco, CA, Feb. 7-9, 2000, pp.86-87.
T. McPherson, et al., "760 MHz G6 S/390 Microprocessor Exploiting Multiple BT and Copper Interconnects", in Proc. Dig. 2000 IEEE International Solid-State Circuits Conference, San Francisco, CA, Feb. 7-9, 2000, pp. 96-97.
R. E. Matick, Transmission Lines for Digital and Communication Networks, McGraw-Hill Book Co., Inc., New York, 1969.
A. Deutsch, H.H. Smith, C. W. Surovic, G. V. Kopcsay, D. A. Webber, P. W. Coteus, G. A Katopis, W. D. Becker, kA. H. Dansky, G. Sai-Halsz, P. J. Restle, "Frequency-Dependent Crosstalk Simulation for On-Chip Interconnections", IEEE Trans. Advanced Packaging, vol. 22, no. 3, pp. 292-308, Aug. 1999.
S. P. Khatri, A. Mehrotra, R. K. Brayton, A. Sangiovanni-Vincentelli, R. H. J. M. Otte, "A Novel VLSI Fabric for Deep Sub-Micron Applications", in Proc. Dig. 36th Design Automation Conference, New Orleans, LA, June 21-25, 1998, pp.491-496.

Note that papers are listed from ISSS'2000, IEEE Transactions on Advanced Packaging, DAC'98, EPEP'98, etc.
TC-12 chair M. Swaminathan and vice-chair A. Deutsch co-edited the August 2000 special issue of the IEEE Transactions on Advanced Packaging based on papers presented at the IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP'99 that was held Oct. 24-26, 1999 in San Diego. The eight papers will appear within two months.
TC-12 chair M. Swaminathan and committee member J. Libous will also organize two sessions on electrical design, simulation and test at the upcoming Interpack'01 that will be held July 8-13, 2001 in Kauai, Hawaii. Paper submission deadline is July 20, 2000 for early acceptance, and November 20, 2000 for regular evaluation. Interested speakers should contact HYPERLINK mailto:madhavan.swaminathan@ee.gatech.edu madhavan.swaminathan@ee.gatech.edu .
TC-12 is also very happy to announce a new initiative for October 20001. TC-12 will organize a half-day workshop entitled Future Directions in IC and Package Design Workshop. The meeting will be held the Saturday before EPEP'2001, on October 20, 2001 in Boston. It is fully sponsored by CPMT and TC-12 is very grateful for Phil Garrou's, VP Technical Activities, support with this initiative. The workshop is intended to focus on future needs in the area of both IC and package electrical design. The best "experts" in the field will be invited to review the present day shortcomings in this area, predict the required research work needed, and give insights into possible ways to achieve these goals. TC-12 feels the workshop will be a very useful addition to the three-day EPEP conference and the one-day short-course sessions that are all run sequentially and are organized entirely by its members.
We hope all the CPMT members will take advantage of the latest developments presented at our web site.

--Alina Deutsch, TC-12 Vice-chair