TC – 6 High Density Interconnect:
> Technical Scope: " High Density Interconnect ......Special attention to an emerging technology."
> TC-6 Mission - "To identify and nurture the latest developments in HDI on a global basis. This includes SLC (Surface Lamina Circuitry) - like technologies, ALVI (Any Layer via Interconnection), and BBIT (Buried Bump
Interconnection Technology) in organic technology as well as high density ceramics capable of meeting 5K - 10K I/O's per chip and other innovative approaches."

> Chair: Connie S. Swager, IBM
phone: 001 732 920 2455( tieline 267-9675), fax: 001 732 920 3023, email: swager@us.ibm.com
> Vice Chair: TBD
> Committee Members:
> Rao Bonda - Motorola - r.bonda@ieee.org
> Raj Masters - AMD - raj.masters@amd.com
> Dave Palmer - Sandia - d.palmer@ieee.org
> John M. Segelken - Lucent Tech - jsegelken@lucent.com
> Pat Thompson - Motorola - p.thompson@ieee.org

> Current TC supported Conferences, workshops, short course worldwide:
Electronic Components and Technology Conference – ECTC
http://www.ectc.net/
NEMI workshop on HDI, http://www.nemi.org/
IPC -microvia workshops, http://www.ipc.org/
IEEE Spring Packaging Workshop - Indian Wells, CA
http://ewh.ieee.org/soc/cpmt/tc14/Spr00wkshp.html
>Opportunity
Contract manufacturers are a group whose needs demand these emerging technologies but at present are not engaged - this presents an opportunity which NEMI is beginning to address.
This is a newly defined Technical Committee. Any members active in the listed meetings or interested in comparing notes on technologies with volunteers from other companies are invited to contact Connie Swager.