The workshop provides a forum for open discussion in all areas of microelectronics reliability and qualification for high reliability and commercial applications. Papers detailing latest results or work in progress will be presented.
· RELIABILITY (accelerated testing, electromigration, hot carrier, TDDB, etc.)
· QUALIFICATION METHODOLOGIES (COTS, screening, ESD, etc.)
· RELIABILITY MODELING AND SIMULATION (devices, materials, atomic scale, etc.)
· MATERIALS (advanced materials, dielectrics, thin oxides, SiGe, III-V, defects, etc.)
· SPECIAL ENVIRONMENTS (radiation, extreme temperature, temperature cycling, etc.)
· ADVANCED TECHNOLOGIES (MEMS, NVM, MOS, advanced devices, etc.)
· PROCESS, PRODUCTION, and YIELD (impact on reliability)
An industrial exhibit will take place at the conference. Exhibit fee is $270 ($300 oversized) and includes one registration. For additional information, please contact:
Registration fee is $120, which includes break service, lunch, exhibit reception, and workshop proceedings. For additional information, please contact: