EPS Consortium Research
Review and Planning Meeting,

October 10-12, 2000

The CALCE EPS Consortium will present its research results and proposed projects to its sponsors at the Research Review and Planning Meeting at the Inn and Conference Center at the University of Maryland, October 10-12, 2000. The first two days will be research review presentations, which cover more than $5M of research being conducted.

Topics will include parts selection, and thermal management, accelerated testing, solder interconnect management, and electronic failure mechanism and analysis. The third day will involve CALCE Consortium members only and will cover new projects presentations for 2001. If your organization is interested in becoming a CALCE Consortium member and you wish to attend this meeting, please contact
Ms. Joan Lee at joanyuan@eng.umd.edu.
Project Presentations
o Non-Solder Joint Failures in Plastic Ball Grid Array Packages and Chip Scale Packages
o Effect of Bending and Moisture on Durability of CSP Assemblies
o Guidelines for Flip-Chip on Ceramic FCOC Assemblies
o Modeling Strategies for High I/O Area Array Packages
o MicroVias and Build-up Technologies for Printed Wire Boards
o Characterization of Advanced Solders
o Calibration of Compact Mechanical Models for Effective Properties of CCA Elements
o Experimental Verification of CALCE Interconnect Stress Models for Thermo-mechanical Loading
o Influence of Vibration Amplitude on Reliability of Electronic Assemblies: An Experimental Study
o Implementation and Reliability Assessment of Microfabricated Thermal Management
o Liquid Cooled MMC Heat Spreaders for High Power Thermal Management

o Smart Thermal Management Systems Based on Solid Liquid Phase Change Materials PCM
o Life-Consumption Monitoring Enabled Physics of Failure Analysis
o Optimization of Stress Profiles for Accelerated Testing
o CCA Handling Guidelines to Prevent Damage Due to Excessive Bowing/Warping
o Thermal Fatigue Model for High Power RF Transistor Interconnect
o MEMS Carrier-Level Reliability
o Development of a Risk Informed Avionics Technology Roadmap
o Effects of New IC Design Rules on Reliability
o Effects of High Altitude on Electronic Components
o Manufacturer Quality and Part Quality and Integrity
o Discrete Passive Parts Selection and Management
o Contract Printed Wiring Board PWB Fabrication Assessment
o Contract Assembly Assessment
o A Life Cycle Perspective to Supply Chain Management and Technology Trend Analyses
o Effects of Cold Start-up on Power Device Reliability
o Techniques for Virtual Qualification of Power Modules II
o CCA Failure Mechanism Webbook Update and NFEM Software
o Software and Guidelines for Accelerated Qualification and Quality
Assurance of Electronic Assemblies
o Wiring Harness Failure Mechanisms
o A Methodology for Reliability Assessment of IC Component Sockets
o Physics of Failure of Displays
o Approaches and Tools for Solving EMC Challenge Analytical Problems
o Shielding Degradation of EMI Enclosures.

Electronic Product and System Cost Analysis Short Course, October 9, 2000

This short course melds elements of traditional engineering economics with manufacturing process modeling and life cycle cost management concepts to form a practical foundation for predicting the cost of CALCE commercial products. Methodologies for calculating the cost of systems will be presented.

Product life cycle costs associated with reliability, life cycle
assessment, and end-of-life scenarios will be discussed. In addition,
various manufacturing cost analysis methods will be presented, including
process-flow, parametric, cost of ownership, and activity based costing.
The effects of learning curves, data uncertainty, test and rework processes, and defects will be considered.

This course will use real-life design scenarios from integrated circuit fabrication, electronic systems assembly, and substrate fabrication as examples of the application of the methods mentioned above.
The cost for this course is $495 for CALCE Consortium members ($695 for non-members). For further information about this course and registration, please contact Dr. Peter Sandborn at (301) 405-3167 or
sandborn@calce.umd.edu.

Electronic Components Alliance Research Review
and Planning Meeting, October 13, 2000

The Electronic Components Alliance (ECA) at the CALCE Center will hold its annual Research Review and Planning Meeting at the Inn and Conference Center at the University of Maryland on October 13, 2000. The meeting will provide an overview and demonstrations of the CADMP-II component reliability assessment software along with presentations on the state of the Alliance, new features in the software, the results of the 1999-2000 research projects, and the proposed new projects for 2000-2001.
The ECA provides its members with leading edge research in risk assessment and mitigation. This support includes spearheading the application of the physics-of-failure approach to reliability assessment, virtual qualification, and accelerated testing to component-level packaging, and developing modern approaches to insertion of commercial devices into harsh environment applications. In addition, Alliance members have access to state-of-the-art software tools for component reliability assessment.
Topics to be discussed at the October 13th meeting include:
Virtual Qualification
o Virtual Qualification of Automotive Components to AEC Q-100
o Modeling the Life of Large Area Solder Die Attach
o Probabilistic Methods for Component Reliability Assessment
Software Enhancements
o Surface Mount Passive Component Attach
o Capability for Modeling Power Hybrids
o Modular Defaults for Package Style
o Web Based CADMP-II Modules
o Integration of Reliability with Cost and Thermal Modeling
High Temperature and Power Electronics Applications
o Reliability Assessment of Alternate Attach Techniques for Power Devices
o Reliability Assessment of Small Scale PressPak Power Packaging
o Comparison of Multilayer and Single Layer Power Device Packaging
o Development of a Qualification Plan for Chip Scale Power Packages

Contact Ms. Betty Bach at betty@calce.umd.edu or (301) 405-4563 for further information.