Forthcoming CPMT Conferences
7th Annual IEEE/DPC Napa KGD Packaging & Test Workshop
Napa Valley, CA September 10-13, 2000
Contact:Larry Gilg (512)338-3748 gilg@mcc.com
Electronics Goes Green
Berlin, Germany September 10-15, 2000
Contact: H. Griese, IZM egg2000@izm.fhg.de
49-30-46-40-31-30 fax 49-30-46-40-31-31
Advanced Semiconductor Manufacturing Conference and Workshop
Boston, Massachusetts September 12-14, 2000
Contact: Margaret Kindling (SEMI) (202) 289-0440
6th International (THERMINIC) Workshop on
Thermal Investigations of ICs & Systems
Budapest, Hungary September 24-27, 2000
Contact Bernard Courtois HYPERLINK mailto:bernard.courtois@imag.fr
bernard.courtois@imag.fr
1-33-4-76-57-46-15 fax 1-33-4-76-47-38-14
Holm Conference on Electrical Contacts
Chicago IL 25-27 September, 2000
Contact: Gerry Witter wittergd@aol.com 847-244-6025/fax 847-244-6041
3rd IEEE CPMT BGA/Flip-Chip/CSP Workshop Cancelled
Binghamton, NY September 25-27, 2000
Contact: Bahgat Sammakia bahgat@binghamton.edu
26th International Electronics Manufacturing Technology
Conference
(IEMT)
Santa Clara, CA 2-3 October, 2000
Contact: Jim Steele james.steele@medtronic.com
(480) 517-3886
2000 IEEE Workshop on Accelerated Stress Testing (AST 2000)
Boulder CO October 4-6, 2000
Contact: Kirk Gray kirkgray@privatei.com
IEEE Fiber Optics, Photonics, Optoelectronics Assembly,
Packaging & Manufacturing: Interactive Workshop (OEP 2000)
Coeur d'Alene, Idaho October 4-6, 2000
Contact IEEE LEOS Confer (732)562-3898
leosconferences@ieee.org
9th Topical Meeting on Electrical Performance of Electronic
Packaging (EPEP)
Scottsdale, AZ 23-25 October, 2000
Contact: Ravi Kaw ( ravi_kaw@agilent.com ) 650-857-8452/fax 650-852-8676
John Prince ( prince@ece.arizona.edu ) 520-621-6187/fax 520-621-2999
http://intermix.engr.arizona.edu/~edp/#EPEP
3rd International Workshop on Smart Card Technologies &
Applications
Berlin, Germany 27-29 November, 2000
Contact: elke.zakel@@ieee.org 49-(0)-30-467-815-55/fax 49-(0)-30-467-815-51
www.pactech.de/CPMT-Germany
International Symposium on Electronic Materials & Packaging
(EMAP 2000)
Hong Kong November 30- December 2, 2000
Contact: EMAP2000 Secretariat, emap@ust.hk
852-2358-7184 fax 852-2358-1543
http:/www.ust.hk/emap2000
5th VLSI Packaging Workshop of Japan
Kyoto Dec 4-6, 2000
Contact: Fuminori Ishitsuka, NTT-AT ishi@atsugi.ntt-at.co.jp
+81-46-240-4053 fax +81-46-247-8431
George Harman george.harman@nist.gov
3rd Annual Polymeric Materials
for Microelectronics & Photonics Applications
London, UK December 4-6, 2000
Contact: Ephraim Suhir suhir@lucent.com
3rd Electronics Packaging Technology Conference (EPTC’2000)
Singapore December 5-7, 2000
Contact: T. B. Lim tblim@ime.org.sg
http://cicfar.ee.nus.sg/eptc.html
2001
7th International Symposium on Advanced Packaging Materials
Braselton GA March 11-14, 2000
Contact 1-888-GO-IMAPS www.imaps.org
Semiconductor Thermal Measurement & Management Symposium
San Jose CA March 20-22, 2000
Contact: Paul Baltes epd@engr.arizona.edu
(520)621-3054 fax: (520)621-1443
http://thermengr.com
2nd Internat. Confer. on Benefiting from Thermal & Mechanical
Simulation in Microelectronics
Berlin, Germany 9-11 April, 2001
Contact: Olivier de Saint Leger compete@mta.fr 33-1-44517400/fax33-1-44517401
www.compete.tm.fr
2001 International Conference on Electronics Packaging (ICEP)
(Formerly IEMT/IMC Symposium)
Tokyo Ryutsu Center, Japan April 18-20, 2001
Contact: Secretariat 2001 ICEP 81-3-5310-2010 fax 81-3-5310-2011
Imaps-j@jiep.or.jp http://www.jiep.or.jp/index.html
Advanced Semiconductor Manufacturing Conference
Munich, Germany April 24-26, 2001
Contact: Margaret Kindling (SEMI) (202) 289-0440
Symposium on Design, Test, Integration & Packaging (DITP
2001) of MEMS/MOEMS
Cannes, France 25-27 April 2001
Contact:
B. Courtois (TIMA) Bernard.Courtois@imag.fr 33-4-76-57-46-15/fax
33-4-76-47-38-14
K. Markus (Cronos) markus@memsrus.com 1-919-380-1316X111/fax 1-
51st Electronic Components & Technology Conference
Lake Buena Vista, FL May 29-June 1, 2001
Contact: Wayne Howell waynehow@us.ibm.com 802-769-7016/fax 954-827-0575
Interpack 2001
Koloa, Kauai HI July 8-13, 2001
Contact smithd@asme.org
Future Directions in IC and Package Design Workshop
Cambridge, MA October 27, 2001
Contact: Paul Baltes epd@engr.arizona.edu 520-621-3054/fax 520-621-1443
Alina Deutsch deutsch@ieee.org 914-945-2858/fax 914-945-2141
Madhavan Swaminathan madhavan.swaminathan@ee.gatech.edu 404-894-3340