INTERPACK'01

Dear Friends: We hope to see you at the InterPACK'01! Please submit your abstracts or mark your calendar for participation. Please forward to people in your organization that might be interested.

The PACIFIC RIM/International, Intersociety,
Electronic Packaging Technical Conference & Exhibition

July 8-13, 2001
Hyatt Regency Kaua'i
Kauai, Hawai'i, USA
https://www.asme.org/conf/ipack01/
Sponsored by ASME and co-sponsored by IEEE/CPMT and JSME.

We have the following outstanding keynote speakers:

William Kennard, Chairman, Federal Communications Commission,
"The New Digital Economy"

Manabu Bonkohara, Director, Association of Super-Advanced Electronic Technologies
"Consortium Activity for System Integration in Japan"

Paul Meche, Principal Scientist, Nokia Mobile Phone
"Engineering Challenges of Telecommunications in the Next Decade"

Vijay Lund, Vice President, Server Technology Development, IBM Corporation
"Future Directions of High End Computing"

Jeffry J. Sniegowski, Distinguished Member of Technical Staff, Sandia
National Laboratories, "MEMS: A New Packaging Challenge"

In addition, we will have 14 technical tracks with papers and panel
discussions. InterPACK'01 is for the international cooperation,
understanding and promotion of efforts and disciplines in
Microelectronics, Photonics, Microwave and Microelectro-mechanical
Systems Packaging Engineering. Please visit our Web site at
https://www.asme.org/conf/ipack01/ and submit your abstracts. If you'd like to participate in one of the technical committees, please communicate with the track chairs posted there.

Thank you for your participation in making InterPACK'01 a success!

Professor Y. C. Lee, General Chair
Professor Kikuo Kishimoto, General Co-Chair
Dr. Donald Price, Conference Program Chair

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Y. C. Lee
University of Colorado, Boulder, CO 80309-0427
(303)492-3393 (phone); (303)492-3498 (FAX)
leeyc@colorado.edu (e-mail)