IEEE KGD Packaging and Test Workshop

September 10-13, 2000

Embassy Suites Napa Valley, California

"The Ultimate Package - Combining Die Products with Today's Substrate Technology"

http://www.mcc.com/projects/dpc/napa2000an.html

This year's workshop agenda again offers a diverse mix of technical information, marketing intelligence and peer interactions - its also a bargain at $325 for a full 3-day workshop. A special workshop feature includes an in-depth discussion of the microelectronics infrastructure in China, and a worldwide marketing perspective from a noted industry analyst. We have 35 technical presentations, a tabletop exhibit featuring a number of suppliers and their products plus the ambience of the beautiful Napa valley. So, for the latest information on die products applications and technology, bare board and populated module testing, plan to be in the wine coutry of California during harvest time, and join your colleagues in an informal information sharing event that will provide valuable insights into the status and progress of KGD Packaging and Test issues worldwide. Please log onto our web page for a complete agenda.

For more information, contact John Wilkes 512 338 3410, email wilkes@mcc.com