OEP 2000

October 4 - 6 2000

Coeur d' Alene Resort, Coeur d' Alene, Idaho

OPTOELECTRONICS PACKAGING

Topics:

• Discrete Component Technology (packages, lenses, silicon based optical devices (SiOB, Si-WG), TECs, fibers, connectors, intergrated passives, WDM, etc.)
• Active Components: Fiber Amplifiers, Pump Lasers, High Speed Modulators, etc.
• Optical MEMS (device design, process technology, reliability, application, etc.)
• Process and Assembly Package Intergration:< 10 Gb/s Signaling Devices
• Process and Assembly Package Integration: > 40 Gb/s Signaling Devices

website: http://www.ieee.org/leos/society