SYSTEMS PACKAGING COMMITTEE
(A Joint Technical Committee of the IEEE CPMT and CS)
The 2001 European System Packaging Workshop
January 22-24, Sitges, Spain (Barcelona)

The IEEE has been holding a European Workshop in January every other year since 1983. They have been in Brussels twice, Cork twice, Weymouth, and Malta. The next European Workshop will be in Barcelona, Spain in January 2001.
This is a Systems Technology oriented workshop with sessions on Wired and Wireless Communications, Power and Noise Management, Automotive, and one session on general technology. There will also be a session on space electronics.
The organizing committee is jointly sponsored by the IEEE Computer Society and the IEEE CPMT Society (TC-14). For the first time, a European Workshop will also be endorsed by IMAPS Europe.

Here is the program committee lineup:
1- Military & Space: Chairs -- Michael Massenat, Matra (now Astrium) –
Yves LeGoff, Dassault (now Detexis-Thomson CSF)
2- Signal and Power Integrity: Chairs -- Professor Troester, ETH Zurich - Thomas Winkel, IBM Germany
3- Cellular and Wireless: Chairs -- Katarina Boustedt, Ericsson - Hans Henzell, ACREO
4- Telephone and Space Tele-communications Equipment: Chairs -- Augustin Coello-Vera, Alcatel –
Emilio Lora-Tamayo, CNM Spain
5- Automotive: Chairs -- Peter Frisk, Kitron Development AB (formerly SAAB Combitech) –
Outi Rusanen, VTT Elektronics
6-Technology: Chairs -- Dag Andersson, IVF - Siegfried Pomgrantz, Motorola Germany

Program Co-chairs: Rolf Aschenbrnner of Fraunhofer, IZM
Erich Klink of IBM Germany

General Chair, John Barrett, Cork Institute of Technology

Arrangement Chair, Francisco Masana, University of Barcelona

SYSTEMS PACKAGING COMMITTEE
(A Joint Technical Committee of the IEEE CS and CPMTS)

In Cooperation with IMAPS Europe
January 2001 Barcelona Workshop
The 2001 European Systems Packaging Workshop
January 22-24 - Sitges, Spain (Barcelona)
The Technical Committee for Systems Packaging wishes to inform you that they will be conducting a workshop next January in Spain. The session topics will be:

1. Automotive Electronics
2. MEMS Technology
3. Space Electronics
4. Packaging Technology
5. Server Systems
6. Cellular & Wireless
7. Signal & Power Integrity

The program will be quite informative for all engineers involved in the field of electronic package design. We invite you to check our web site at: http://www.ewh.ieee.org/soc/cpmt/tc14/ewkshp.html for the complete program and registration information.