Preliminary Program HDP'2000

Thursday am. Dec. 14, 2000

Registration for Chinese: starting from 8:00 at SIM
Chair: Professor Luo Le, DC SIM Tech

9:00-9:10 Welcome Speech
Professor Liqiang XU, Deputy General Manager, DC SIM Tech

9:10-9:50
Invited talk, C.P. Wong,
School of Materials Sciences and Engineering and Packaging Research Center
Georgia Institute of Technology, Atlanta, USA
"Recent advances in high performance low cost electronic packaging",

9:50-10:30
Invited talk, Wayne Koh, Director, advance packaging & assembly technology
Kingston Technology Co., Ltd.
"Packaging technology for high density memory modules"

10:30-10:45
Break

10:45-11:25
Invited talk, Johan Liu,
"Microelectronics packaging and manufacturing road map and trend for Swedish electronics industry"

11:25-11:50
Oral presentation, Francis Su, ChipMos
"The high quality wire sweep analysis for IC packages"

Lunch

Thursday pm. Dec. 14, 2000

Chair: Professor Xie Xiaoming

13:30-14:10
Invited talk, Janet Semmens, Sonoscan
"Flip chips and acoustic micro imaging: an overview of past applications, present status, and roadmap for the future", Janet E. Semmens, Sonoscan.

14:10-14:35
Oral presentation, Mr. Rene Hoeg, Buehler
"Seeing is believing - the power of examining cross sections"

14:35-15:00
Oral presentation, Xu BaoHong, Sun East
"Quality control of SMT assembly", Mr. Xu Bao Hong, Sun East

15:00-15:15
Break

15:15-15:55
Invited talk, Professor Xie Xiaoming, DC SIM Tech.
"Reliability investigation and failure analysis for underfilled flip chip packages"

15:55-16:35
Invited talk, Professor Luo Le, DC SIM Tech
"Thermal impact on the reliability of lead free soldering"

16:35-
Lab tour

18:30-20:30
Buffet and free discussion
(foreign attendants are asked to be at the symposium location at 6:00 pm for participating)

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Friday am., Dec. 15, 2000

Registration for foreign participants: starting from 8:00 at SIM

Chair: Professor C.P. Wong

9:00-9:10
Welcome speech
Dr. Frank Stubhan, General Manager of DC SIM Tech.

9:10-9:50
Invited Talk, Horation Quinones, AsymTek,
"Underfill dispensing"?

9:50-10:15
Oral presentation, Ms Gisela Kaltenpoth, DaimlerChrysler AG
"Effect of harsh environment on the performance of the underfiled flip chip packages"

10:15-10:40
Oral presentation, C.P. Wong
"Development of No-Flow Underfill Process for Lead-Free Bumped Flip-Chip
Assemblies"

10:40-10:55
Break

Chair: Professor Johan Liu

10:55-11:35
Invited talk, Dr. G. Sommer, Fraunhofer Institute of Reliability and Micro-integration
"Workflow for RF Modeling of Chip Packages for High Density System Development"

11:35-12:00
Oral presentation, Arne Tolvgård, Ericsson Radio Systems
"Compact and Green Packaging, " Silicon Close Connection/Cooling/Encapsulation" is a Challenge for Radio Base Station.

12:00-12:25
Oral presentation, Y. Fu, Chalmers University
"Microwave transmission through electrically conductive adhesives"

Lunch

Friday pm., Dec. 15, 2000

Chair: Dr. Wayne Koh

13:30-14:10
Invited talk, C.M. L. Wu, City University of Hong Kong
"High Energy Impact of SM Solder and ICA Joints"

14:10-14:35
Oral presentation, Leung, Hong Kong University of Science of Technology
"Characterization methodology for interfacial adhesion between polymer and substrate interfaces"

14:35-15:00
Oral presentation, C.P. Wong, Georgia Tech
"Development of Solder Replacement Conductive Adhesives with Stable Resistance and Superior Impact Performance"

15:00-15:15
Break

15:15-15:40
Oral presentation
Xin Wu, Motorola

15:40-16:05
Oral presentation
"Low Cycle fatigue of Lead free solders", Xitao Wang, Chalmers University

16:05-16:30
Oral presentation
"Heat Transfer modeling of System in a Package (SIP) for various substrates, Xitao Wang, Chalmers University

16:30-
Lab tour, DC SIM Tech

18:30-20:00
Dinner
Saturday am, Dec. 16, 2000
Visit Ericsson SIMTEK