Jack Balde Awarded

Jack Balde received the Daniel C. Hughes Memorial Award for his dedication to IMAPS and to the electronics packaging industry. George Harman of NIST, a member of the Hughes Award Selection Committee, said of Mr. Balde, "His active leadership role in conference organization and structure has been a major force behind the successful development of numerous conferences and workshops, notably in the areas of Surface Mount Technology and Multi-chip Modules. The technical achievements of packaging professionals throughout the industry are a tribute to his tireless efforts in intersociety task forces, standards and numerous other committee activities."

This is the most prestigious award given by IMAPS. It is earned by the individual who has the greatest combination of technical achievements related to hybrid microelectronics, combined with outstanding contributions supporting this industry.

--from IMAPS press release.