CPMT Meetings of Interest in 2001

7th International Symposium on Advanced Packaging Materials
Braselton GA March 11-14, 2000
Contact 1-888-GO-IMAPS www.imaps.org

Semiconductor Thermal Measurement & Management Symposium
San Jose CA March 20-22, 2000
Contact: Paul Baltes epd@engr.arizona.edu
(520)621-3054 fax: (520)621-1443
http://thermengr.com

2nd Internat. Confer. on Benefiting from Thermal & Mechanical Simulation in Microelectronics
Berlin, Germany 9-11 April, 2001
Contact: Olivier de Saint Leger compete@mta.fr 33-1-44517400/fax33-1-44517401
www.compete.tm.fr

2001 International Conference on Electronics Packaging (ICEP)
(Formerly IEMT/IMC Symposium)
Tokyo Ryutsu Center, Japan April 18-20, 2001
Contact: Secretariat 2001 ICEP 81-3-5310-2010 fax 81-3-5310-2011
Imaps-j@jiep.or.jp http://www.jiep.or.jp/index.html

Advanced Semiconductor Manufacturing Conference
Munich, Germany April 24-26, 2001
Contact: Margaret Kindling (SEMI) (202) 289-0440

Symposium on Design, Test, Integration & Packaging (DITP 2001) of MEMS/MOEMS
Cannes, France 25-27 April 2001
Contact:
B. Courtois (TIMA) Bernard.Courtois@imag.fr 33-4-76-57-46-15/fax 33-4-76-47-38-14
K. Markus (Cronos) markus@memsrus.com 1-919-380-1316X111/fax 1-

51st Electronic Components & Technology Conference
Lake Buena Vista, FL May 29-June 1, 2001
Contact: Wayne Howell waynehow@us.ibm.com 802-769-7016/fax 954-827-0575

Interpack 2001
Koloa, Kauai HI July 8-13, 2001
Contact smithd@asme.org

ISEPT'2001 = International Symposium on Electronic Packaging Technology
Beijing, China ...August 22-26, 2001
Contact: Prof. Josheng Ma, FAX 86-10-62772724, email: temptm@mail.tsinghua.edu.cn

Future Directions in IC and Package Design Workshop
Cambridge, MA October 27, 2001
Contact: Paul Baltes epd@engr.arizona.edu 520-621-3054/fax 520-621-1443
Alina Deutsch deutsch@ieee.org 914-945-2858/fax 914-945-2141
Madhavan Swaminathan madhavan.swaminathan@ee.gatech.edu 404-894-3340