SEMI-THERM
March 20-22, San Jose
Session Topics:
Simulation in Thermal Management
Chair: Bill Maltz
Novel Measurement Techniques
Chair Savithri Subramanyam
Advances in Compact Models
Chair Wendy Luiten
Active Cooling Technology
Chair: Alan Claasen
Thermal Enhancement Technology
Chair: Alfonso Ortega
Component Thermal Performance
Chair: Paul Hundt
Short Course
The optional Short Course held Sunday and Monday, March 18
and 19 will be conducted by Robert E Simons, a retired IBM engineering
manager. This intensive short course is titled "Thermal
Design for Electronics Cooling Applications," and is designed
to provide an appreciation and understanding of the important
role of thermal design in the development and operation of electronic
equipment, as well as the basic techniques for estimating thermal
performance of electronic packages and systems.
Workshop
Tuesday evening's workshop is a panel discussion chaired by
Jeff Montgomery of Electronicast. "Thermal Issues in Optoelectronic
Packaging," takes a look at optical and thermal issues in
the packaging of optical IC's and similar devices. New to SEMI-THERM
this year is a panel discussion concluding Wednesday mornings
technical sessions, "System Level Modeling---Status and Challenges",
chaired by Roger Schmidt, IBM.
Luncheon Speakers
The technical luncheon presentation on Tuesday, March 20 features
Jukka Rantala of Nokia Research Center speaking on "Thermal
Management Challenges of Third Generation Telecommunication Devices."
Wednesday's non-technical luncheon presentation will be given
by Robert Moffat of Stanford University and president of Moffat
Thermosciences, Inc. Entitled "The Arte of Fyshing with an
Angle----in the 21st Century." Dr. Moffat will take a historical
look at fly-fishing, the politics of trout fishing and the serious
considerations of stream husbandry.
Thermi
Each year, SEMI-THERM honors a person as a Significant Contributor
to the field of semiconductor thermal management. The "THERMI"
award is intended to recognize a recipient's history of contributions
to important thermal issues affecting the performance of semiconductor
devices. This year's "THERMI" will be presented to
Clemens J. M. Lasance of Philips Research, The Netherlands. He
will receive this prestigious award on Thursday, March 22 at the
awards luncheon.
Posters
In an effort to allow more papers into the conference, a poster
session was started last year and continued into this year. There
will be eight poster papers presented at SEMI-THERM XVII with
session chair Seri Lee of Intel presiding. The poster sessions
are scheduled for Tuesday, March 20 from 1:30 to 3:00 pm with
five-minute presentations from each poster paper presenter during
the morning technical sessions.