5th VLSI Packaging Workshop of Japan
Kyoto, December 4-6, 2000
The Fifth VLSI Workshop in Japan was successfully held in Kyoto. Approximately 50 attended this interactive meeting including 20 from overseas. It was sponsored by and registered with CPMT. This Japanese workshop has been held biannually since it started in 1992. Professor Kanji Otsuka (a current member of the CPMT BOG) was its first Chairman. The present conference Chairman was Dr. Atsushi Nakamura of Hitachi. The General Chair for the 2002 workshop will be Atsushi Nakamura from Hitachi and the Vice Chair will be Max Kohno from Dow Chemical Japan. The attendance was lower than in past years presumably because of two other CPMT-sponsored Asian conferences (held within the same one week period) which limited attendance from Singapore and Hong Kong.
There were a total of 32 half-hour papers plus an afternoon panel session on electrical performance, which was extremely successful. All papers were given in plenary sessions. The papers covered the entire range of packaging as opposed to most present-day workshops that concentrate on one single subject (e.g. flip chip). When people left the workshop they had been exposed to the entire state of the art of electronic packaging.
There were sessions on 3-D packaging for higher density and speed, papers on high-speed electrical performance, CSPs, fine pitch interconnections, thermal characterization and materials, including buildup layers. There were papers on copper conductor chips, wafer level packaging, optical and CCD packaging, and all in all, every imaginable type of packages.
Copies of the 114 page proceedings may be purchased through
Dr. Atsushi Nakamura
<nakamura-atsushi4@sic.hitachi.co.jp>
-- submitted by George Harman and Phil Garrou
2. Picture of all the attendee to the VLSI Packaging Workshop including 20 from around the world.