SHORT COURSES -- ECTC
May 29, 2001

Morning Short Courses
8:30 AM - 12:00 PM

1. Fiber-Optics Interconnects: Design for Reliability

2. RF/Wireless Packaging: Status and Challenges

3. Microelectronics Packaging and Interconnection - A Worldwide Perspective

4. Chip Scale Packaging

5. Eliminating Lead in Electronic Assemblies

6. Part I - Polymers for Electronic Packaging: - Materials, Process and Reliability: The Fundamentals of Packaging and Materials
Science & Engineering

7. Optoelectronics Part I: Business and Technical Perspectives for Optical Networking and Opto-electronics Components

Afternoon Short Courses
1:30 PM - 5:00 PM

8. Wafer Scale Packaging - Principles and Practices

9. System on Package (SOP), A Major Paradigm in Microsystems Packaging

10. Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies

11. Applications of Micromachines in Optical Networking

12. Dynamic Response of Microelectronic and Photonic Structures to Shocks and
Vibrations: Predictive Modeling and Failure Prevention

13. Part II - Polymers for Electronic Packaging: Materials, Process and Reliability

14. Optoelectronics Part II: Optoelectronics Components and Modules for Datacom and Telecom