PRESS RELEASE

Georgia Tech PRC to Offer the First Two-week Short Course on Next-generation Microsystems Packaging Technologies

Georgia Tech's Packaging Research Center (PRC) will offer the first of its kind two-week long short course on next-generation microsystems packaging technologies from May 14th to May 25th at the Georgia Tech campus. This two-week long short course is based on the PRC's System-on-Package (SOP) vision which integrates not only digital functions but also analog, RF, opto and MEMS functions into one ultra compact and low cost system to serve the needs of telecom, consumer and computer industries in the 21st century. The SOP paradigm changes the current chip-centric system design methodology to a cheaper and faster-to-market systems package-centric design flow. The course will be instructed by faculty from Georgia Tech and also by industry experts. The short course will cover systematically and comprehensively all the critical technologies from systems to devices including microelectronics, photonics, MEMS and systems packaging:

· System-on-Package (SOP) vs. System-on-Chip (SOC)
· RF and Wireless Systems and Packaging
· Optical Network Systems and Packaging
· MEMS-based systems and packaging
· Chip-scale Packaging
· Wafer-level Packaging
· Thermal Management
· Reliability
· Mixed-signal Electrical Test
· Integral Passives
· High Density Microvia Board Technology
· Flip Chip Processing and Analysis
· Polymers in Microsystems Packaging
· Giga-scale CMOS Integrated Circuits
· Mixed-signal Design

For more information visit the PRC's web site at www.prc.gatech.edu after January 15, 2001.