OEP 2000
The 2nd IEEE Optoelectronics Packaging
Workshop Abounds as Industry Demands Photonics Packaging Expertise
Following in the footsteps of last year's inaugural CPMT and
LEOS sponsored Workshop on Fiber-Optics, Optoelectronics and Photonics
Assembly, Packaging and Manufacturing, OEP 2000 was held Oct.
4-6, 2000 at the Coeur d' Alene Resort in Coeur d' Alene, Idaho.
OEP was created through collaboration between CPMT TC-10 (Fiber
Optics and Photonics), the ECTC Optoelectronics Program Committee,
and the LEOS Annual Meeting Optoelectronics Packaging, Manufacturing
and Reliablity Program Committee. As a result of this collaboration,
the OEP format has proven itself viable for discussing current
issues in a non-competitive environment, free from the formality
associated with conference proceedings and published manuscripts.
Again in 2000, LEOS Conferences provided staff support for the
OEP workshop.
OEP 2000 attracted 180 attendees from around the globe, with
participation coming from industry, academia, and the financial/investment
community. Workshop attendees provided thought provoking discussions
on topics ranging from fiber amplifiers, package components, 10
- 40 Gb/s optical transmission devices, and optical MEMS. Evening
poster sessions provided ample opportunity to discuss a variety
of emerging optoelectronic device packaging and manufacturing
topics. Representatives from the technology investment community
provided notable insights on the role packaging innovation plays
in today's dynamic optical communications market.
Workshop Invited Presentations
Alan Morrow, Corning, "High Performance EDFAs"
Jim Nering, Lucent Technologies, "Fiber Amplifier Packaging"
Atikem Haile-Mariam, Intel Capital, "Micro Packaging Challenges
& Advances in High Speed Optoelectronics - An Investors Perspective"
Jerry Byrd, Lucent Technologies, "High Speed, High Performance
Laser Module"
Susanne Arney, Lucent Technologies, "Design for Reliability
of MEMS for Lightwave Telecommunications"
Sambu Dakuginow, Texas Instruments, "Packaging the Digital
Micromirror DeviceTM"
Holger Karstensen, Infineon, "Parallel Optical Modules"
Ephraim Suhir, Lucent Technologies, "Fiber Optics Structures:
Design for Reliability"
Timothy Holloway, NSI, "Optoelectronics Components".
As the demand for optoelectronics packaging innovation continues to surge, events such as OEP become increas-ingly important to help industry and academia better understand requirements for developing and sustaining optoelectronic technology in today's world. The topics of packaging integration, manufacturing automation, higher speed, higher density and lower cost packaging continue to challenge today's packaging engineer. Through its conferences and workshops, CPMT and LEOS continue to provide optoelectronic packaging researchers, engineers, suppliers and manufacturing equipment developers a forum to exchange ideas and learn more about optoelectronic packaging technology. Volunteers are needed to begin OEP planning for 2002.
Pictures
Randy Heyler, OEP2000 General Chairman
John Osenbach, OEP2000 Program Chairman
Atikem Haile-Mariam on investors' perspective to OE packaging
Michael Lebby provides insight to investment in OE packaging