Polytronic 2001

(including merging of POLY, PEP, Adhesion in Electronics meetings)

October 21 - 24, 2001

Dorint Sanssouci Potsdam Germany

Abstract Deadline = March 30, 2001: Submit electronically as pdf-file or a word document to polyorg@izm.fhg.de, and fax to +49 (0) 30 46403 161

Home web site: http://www.izm.fhg.de/polytronic_2001/

You are invited to submit an abstract for participation at the 1st International Conference POLYTRONIC 2001. The idea of the conference is to continue the successful series of IEEE workshops and conferences on adhesives and polymers. this new joint conference is incorporating Polymeric Materials for Microelectronics and Photonics Application (POLY), Adhesives in Electronics and Polymeric Electronics Packaging (PEP). The main objective is to provide a forum for experts to present their findings and innovations, and to exchange ideas on topics regarding different aspects of adhesives and polymers in microelectronic and photonics. The conference will take place at the Dorint Hotel, located in the historic center of Potsdam near Berlin, Germany.

TOPICS

Materials: themosetting/thermoplastic systems; inorganic adhesives; composites; filler materials; isotropic conductive adhesives; anisotropic conductive adhesive; pastes and films; heat seal connectors; thermally conductive adhesives; polymers with adapted refractive index; photosensitive polymers; high temperature materials; PCB materials, polymer thick and thin films, low and high dielectric materials.

Processing and Manufacturing: Lamination; printing; dispensing; spraying; transfer techniques; injection and transfer molding; potting; adhesion improvement; curing; equipment; statistical process control; economic analyses.

Applications: electrical conductive adhesive joining; underfill; glob tops; die attach; potting compounds; encapsulation; polymer coatings; shielding; smart card tags; plastic packages; optoelectronics and photonics; MEMS; microelectronic systems; polymer optical fibers; polymer wave guides; ultra thin systems; polymer electronic devices; organic displays; polymer batteries; new and emerging technologies.

Design: design, modeling, and simulation of materials and systems.

Reliability and Testing: thermo-mechanical behavior; degradation mechanisms; adhesion; hermeticity; accelerated testing, humidity and environmental sensitivities; non-destructive testing methods; stress behavior.

Environment: Ecology and toxicology; life cycle analysis.

General Chair: Rolf Aschenbrenner - Fraunhofer IZM, Germany

Co-Chairs: Jurgen Berger - VDI/VDE-IT, Germany; Bernd Michel - Fraunhofer ISM, Germany

Advisory Board: Ephraim Suhir - Lucent, USA, Johan Liu - Chalmers University