CALL FOR PAPERS
EPEP
October 29 - 31
Cambridge,
Massachusetts
Co-Chairs:
George Katopis, IBM Corporation
John Prince, The University of Arizona
The general subject of the meeting is the electrical modeling,
design,
analysis, and characterization of electronic interconnections
and
packaging structures. A forum will be provided for the discussion
of
the following topics as they relate to chip-to-chip and on-chip
interconnections in electronic systems:
Package analysis, including numerical methods and algorithms
Electro-magnetic analysis tools
Advances in transmission-line techniques
Power distribution and package resonance
Switching noise in multi-layered structures
Impact of OE/EO transducers on performance of module-level
and inter-module interconnects
RF/microwave packaging structures and their electrical performance
Multilayer LTCC packaging for microwave applications
MMIC modules and high density packaging
Experimental characterization techniques and testing procedures
EMC/EMI sources & effects
Prediction and measurement of radiation from on-chip sources,
inter-connect structures and packaged systems
Long distance propagation in large switching complexes
Electrical issues in MEMS packaging
New and innovative interconnect packaging structures and their
electrical performance
Electrical design implications for low cost, high volume packaging
Packaging concerns for wireless communication: design and modeling
Packaging solutions for one chip radios: design and modeling
Performance of low cost packaging solutions for communications
systems
Performance of packaging for automotive radar systems
Optoelectronic packaging: structure and system applications
Current and future issues related to on-chip interconnections
Router friendly models and modeling tools: accuracy & efficiency
Modeling and design of high speed digital IO circuits: signal
propagation and reception
On-chip power delivery and regulation
Advances in modeling core switching noise, and design of novel
solutions
On-chip measurement techniques
This is the tenth meeting in this topical series. The last meeting
was
very well attended and was held in Scottsdale, Arizona, from October
23-25, 2000.
Additional information may be obtained from the Meeting
Co-Chairs or the Administrative Chair:
George Katopis, email: katopis@us.ibm.com
John L. Prince, email: prince@ece.arizona.edu
Paul Baltes, email: baltes@engr.arizona.edu
Copies of the 2000 meeting digest can be obtained from IEEE
by
requesting the publication catalog number 00TH8524 at phone:
732-981-0060 or FAX: 732-981-0027.
PAPER SUBMISSION
Authors are invited to submit papers describing new technical
contributions in the
areas broadly covered in the Call for Papers. Papers may be submitted
in one of
two ways:
1) A camera-ready original and three copies of a summary, not
to exceed FOUR
PAGES, in single-column format, including illustrations, may be
mailed to the
address below. In your cover letter, prioritize three key words
from the topic list
that best represent your paper. All papers must be written in
English. The title of
the paper and the names and affiliations of all authors, including
complete mailing
addresses, telephone, FAX numbers and email addresses must appear
on the
first page of the summary, as well as a 35 word abstract. Email
is absolutely
necessary since it will be used for all communication with authors.
Failure to
provide the author(s) email address may result in non-selection
of the abstract.
If the paper is accepted, the summary will be reproduced, as is,
in the meeting's
digest.
2)The paper, formatted as described above, may be sent as PDF
file or as a text
file attachment to the address below.
An IEEE transfer of copyright form may be found at:
www.ieee.org/about/documentation/copyright/cfrmlink.htm and must
accompany
each submission. Submissions should be sent, not later than July
10, 2001, to:
Engineering Professional Development
University of Arizona
1224 N. Vine Avenue
Tucson, AZ 85719
Tel: 520-621-5104/Fax: 520-621-1443
Email: epd@engr.arizona.edu