Call for Abstracts

ITherm 2002: Eighth Intersociety Conference on Thermal
and Thermomechanical Phenomena in Electronic Systems
May 29- June 1, 2002
Sheraton San Diego Hotel & Marina, San Diego, California

ITherm 2002 is an international conference that brings together engineers and scientists from industry, academia and government research organizations for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with all aspects (die to system) of electronic systems: from pagers to cell phones, from lap-top computers to supercomputers, from consumer and automotive to space electronics. The objective is to address current topics in the broad areas of thermal, thermomechanical and multidisciplinary areas in current and emerging electronic systems.
ITherm 2002 will be co-located with the 52nd Electronic Components and Technology Conference (ECTC 2002), which offers a broad range of current and new developments in all areas of electronic technology. In addition to paper presentations and panel discussions, ITherm 2002 will include vendor exhibits, keynote lectures by prominent speakers, and professional short courses. Please visit our web site at http://www.itherm.org/ for latest conference related information. Original papers are solicited in general areas of Thermal Management, Mechanics (thermo-mechanical and mechanical) issues and related issues in Emerging Technologies.
Thermal:
· Natural and forced convection air-cooling
· Liquid cooling
· Novel cooling techniques: phase change, heat pipes, thermosyphon, liquid-cooled heat sinks and evaporation
· Microchannel, micro- and nano-scale heat transfer and fluidics
· Thermal management and mechanical issues in high power dissipation packages and systems including novel heat sinks.
· Active: thermo-electric, air movers, refrigeration
· Thermal aspects of systems-on-a-chip
· Methods for mitigating effects of extreme thermal environments
· New approaches to microelectronics thermal management
· Experimental characterization: methods and measurement techniques in thermal management, thermal contact resistance, flow and temperature visualization, performance of thermal interface materials (adhesives, thermal paste)
Mechanics:
· Role of fracture mechanics in electronic packaging
· Solder joint reliability and fatigue: modeling and experimental
· Solder profile modeling, fatigue mechanics of packages, interconnects
· Mechanical reliability of advanced packages, and multilayered structures manufacturing/assembly and field-use conditions
· Impact and vibrational analysis of packages, sub-systems, and systems
· Experimental methods, model validation, material characterization
· Mechanics of environmental-friendly materials in electronics
· Thermal and thermomechanical characterization of materials: organics (dielectrics, solder mask, LTCC etc., solders, PB-free solders)
Emerging Technologies: Thermal, Thermomechanical and/or related underlying multidisciplinary issues in:
· Space systems: earth orbiting and deep-space missions
· Fiber-optics interconnect systems
· Free space optical interconnects
· MEMS: device and package level reliability issues.
· Mechanics, material and process related issues in Nanostructures.
· Portable/handheld electronics, such as cell phone, pager, notebooks, computers, peripheral hardware, disc drives, displays, printers
· Medical, telecommunication, and automotive systems
Panel Discussions:
· Proposals are solicited for panel discussion topics addressing contemporary issues of broad interest to ITherm. These should include a title, an abstract describing the theme(s) to be addressed, and a list of potential panelists.
Software Tools/Techniques: Design, Analysis, Simulation
· CAD, CFD, FEA, EDA software tools and trends in their interoperability.
· Flow network modeling
· Model validation/benchmarking
· Development of behavioral (or compact) models (e.g., component, heat sinks)
· Interoperability and emerging standards across cross-disciplinary software tools

To submit a paper for consideration, please enter a 250-word abstract by August 15, 2001 at the ITherm website at http://www.itherm.org/.