ECTC Luncheon

On May 30 the ECTC organizing committee held their luncheon for the hordes of engineers at the Conference. General Chair Peter Slota introduced those at the head table amid the sounds of clanking silverware and smacking lips: Michael McShane (Vice Chair), Robert Willis (Admin Vice Chair), Wayne Howell (Program Chair), Steve Bezuk (Assistant Program Chair), Peter Walsh (Arrangements Chair), John Lau (Publications Chair), Bill Moody (Finance Chair), Mino Dautartas (Web Admin), James Bruorton (Publicity Chair), Glyndwr Smith (EIA/ECA rep).

The best paper from last year's Conference was awarded for "Comparison of Active and Passive Fiber Alignment Techniques for Multimode Laser Pigtailing" by Pentti Karioja, Jyrki Ollila, Veli-Pekka Putila, Kimmo Keranen, Jonna Hakkila, and Harri Kopola of VTT Electronics & Infotech Oulu.

The best Poster Paper went to "Modeling and Simulation of the Dynamic Response of the Electronic Packaging" by Xiaoling He and Robert Fulton of Georgia Tech.

Outstanding Paper Awards for the 2000 Conference were earned for:

"Experimental and Numerical Reliability Investigations of FCOB Assemblies with Process-induced Defects" by A. Schubert, R. Dudek, J. Kloeser, B. Michel, and H. Heichl of the Fraunhofer Institute as well as T. Houck and K. Kaskoun of Motorola.

"A Compact, Low-Cost WDM Transceiver for the LAN" by Brian Lemoff, Lisa Buckman, Andrew Schmit, and David Dolfi of Agilent Laboratories.

The Outstanding Poster Paper went for "Time Dependent Material for Finite Element Analysis of Flip Chips" by Frank Feustel, Steffen Wiese, and Ekkehard Meusel of Dresden University of Technology.

C. P. Wong the CPMT Society liaison with ECTC then gave the outstanding achievement award to Peter Slota, General Chair of this year's ECTC. It was announced that more than 900 were attending ECTC from 23 countries. There were 71 Vendor Displays. On Tuesday there were 13 short courses with 400 continuing students.

A talk was given by Kazuo Eda of Matsushita Electric / Panasonic. He focused on "Mobile Internet - and the needed Advanced Packaging. He stated that there were 400 million portable phones sold last year. This compares with 30 million laptops. Using the very successful I-mode technology in Japan most users can get to the Internet. This consumer trend is called "Keitai" in Japan which is equivalent to "Handheld or Portable" in the U.S.
He quipped that the change I-mode has brought is one from "a conversation culture to a thumb culture". Flip-chip is essential to accommodate the I/O count needed in the small volume. He sees the projections easily going to nano-scale fab and billion unit/year capacity. He referred to IDM (integrated Device Module) as a sytem to simplify manufacturing by integration. One example mentioned was direct conversion detection. He sees SiGeC, multi-layer ceramic as coaxial filter resonators, and complex SAW correlators/filters as some examples of steps in this direction. He sees built-in pins, capacitors, inductors and SAW filters in multilayer ceramic packages (see SOP notes by Rao Tummala). He saw stud bump bonding using gold and conductive resin as taking over from Sn-Pb for fine pitch and operation up to 10 GHz.

Figure: All the luncheons were packed and enjoyed by all. In Foreground, Dennis Olsen givens a thumbs up at finding two desserts at his place setting.