InterPACK'01

We hope to see you at the InterPACK'01! Abstracts were submitted by November 20, 2000 but there may still be room for some special last minute news-breaking technical results. Mark your calendar for July 3-13, 2001 and pack for the Hyatt Regency Kaua'i in Hawaii USA. This meeting has been co-sponsored for a number of years by CPMT, ASME, and JSME.

Web site: http://www.asme.org/conf/ipack01/

Keynote Speakers:

William Kennard, Chairman of the Federal Communications Commission, "The New Digital Economy"

Manubu Bonkohara, Director Association of Super-Advanced Electronic Technologies, "Consortium Activity for System Integration in Japan"

Paul Meche, Principal Scientist at Nokia Mobile Phone, "Engineering Challenges of Telecommunications in the Next Decade"

Vijay Lund, Vice President at Server Technology Development in IBM Corporation, "Future Directions of High End Computing"

Jeffrey J. Sniegowski, MEMX incorporated, formerly of Sandia National Laboratories, "MEMS: A New Packaging Challenge"

Conference Managers

General Chair: Prof. Y. C. Lee, University of Colorado at Boulder

General Co-Chair: Prof. Kikuo Kishimoto, Tokyo Institute of Technology

Conference Program Chair: Dr. Donald Price, Raytheon Electronic Systems