- You work
hard.
We notice.
BEST PAPER:
IEEE Transactions on Components and Packaging Technologies:
1999:
- "Low-Frequency
Noise in Thick-Film Resistors Due to Two-StepTunneling Process
in Insulator Layer of Element MIM Cell",
- Milan M.
Jevtic, Zravko Stanimirovic, and Ivanka Mrak -- Institute of
Physics, Telecommunications and Electronics Institute, Belgrade
Yugoslavia (march, 1999)
- 2000:
- "Development
of Virtual Reliability Methodology for Area-Array Devices Used
in Implantable and Automotive Applications",
- Suresh Sitaraman,
Rajiv Raghunathan, and Carlton Hanna -
Georgia Institute of Technology, Intel Corp. (September 2000)
View these
papers on-line: http://ieeexplore.ieee.org/