TC-5 Meets During ECTC
Chair Rajen Chanchani of the Materials and Processing Technical Committee held an organizational breakfast meeting during the Orlando ECTC. The team talked about the upcoming Advanced Packaging Materials Conference to be held in Atlanta on March 3 - 6, 2002. This will be the first year this conference will be sponsored 50/50 by IEEE-CPMT and Georgia Tech.
In addition, the globalization of TC-5 Committee was discussed. In the future there will be two TC-5 meetings, one in the U.S. (in conjunction with ECTC) and the other either in Asia or in Europe in the Autumn. To assist in this globalization effort, an online community of people interested in TC-5 activities will be established by creating a list of addresses under a "MAJORDOMO". The goal is to make this the forum of choice for communicating "great" ideas aimed at specific member concerns on packaging materials and processes with each other.
-- Rajen Chanchani
Figures:
1. TC-5 Chair Rajen Chanchani talking with Jim Morris (VP Conferences) and C. P. Wong (TAB representative) about next year's Advanced Packaging Materials Conference.
2. TC-5 breakfast meeting around table: Rajen Chanchani, C.C. Lee, Eric Perfecto.