TC-9 Thermal Management and Thermomechanical Design

Tony Mak, Chair of CPMT "Thermal Management and Thermomechanical Design Technical Committee" held a breakfast meeting on Thursday at the Wyndham Palace at Disney World. Tony showed everyone the updated handbook pages for TC-9. He announced the deadline for the TC-9 Newsletter was June 15th.

There was discussion on the success of the San Jose Semi-Therm meeting. The need to add a poster session was reviewed. An evening workshop on Thermal Aspects of Opto-electronic Packaging was mentioned. The "Thermi Paper Award" was won by Clemen Lasance, and the Outstanding paper award went to Linan Jiana.

The 2002 I-Therm meeting will be in the second half of the week as ECTC meetins in San Diego. The Program Program Chair is Christina Amam. More information can be found at itherm.org. The Due date fo;r abstracts is August 15, 2001.

The next Semi-Therm meets in March 2002 with the deadline for abstracts is September 17. the web site is thermengr.com.

Kouchi reported on the 2001 EuroSimE held in Paris on April 8-=11. This was the second time it was held and about 100 engineers participated. Most were from Europe but there was international representation. This is the only conference which concentrates on the Thermal-Mechanical concerns, with 50 presentations addressing solutions.

There was some discussion on how EuroSimE and Therminics workshops work together. In both cases Paul Wesling guides the Proceedings through the IEEE system. Both events need more volunteer help particularly fro TC-9. In addition, more U.S. involvement should be sought.

Avi-Bar Cohen is now the Distinguished Lecturer for this Technical Committee. Among other things this means that Chapters and Universities can request CPMT help in having Avi speak at their events.

Goram Matijasevic discussed the thermal aspects of the NEMI roadmap which he helped put together. He described the sea change from the past when no one thought hand held applications could possibly have thermal problems. However, as batteries have improved and chips have shrunk in size, 5 watt operation often demands innovative solutions. Another big roadmap challenge is the 300 W microprocessors scheduled for 2012.

Figure: Chair Tony Mak leading his breakfast meeting at ECTC