Call for Abstracts
Abstract Deadline: November 19, 2001

INTERNATIONAL WORKSHOP ON
WAFER LEVEL CSP AND FLIP CHIP PACKAGING

Evergreen Marriott Conference Resort at Stone Mountain Park
Stone Mountain, Georgia, USA
March 1-3, 2002

Proposed Sponsors
IEEE Components, Packaging and Manufacturing Technology Society (IEEE-CPMT)
ASME Electrical and Electronics Packaging Division (ASME-EEPD)
MRS
American Ceramic Society
IZM, Germany
Packaging Research Center

GENERAL CHAIR:
Rao Tummala
Georgia Institute of Technology
rao.tummala@ee.gatech.edu

Session Topics:

· Wafer Level Packaging Processes
· Wafer Packaging Materials
· Wafer Level Burn-In and Test
· Wafer Package Reliability
· Small Die & Memory Products
· Ultra high density Substrate Technologies for WLP
· New & Advanced wafer Technologies
· National Consortium - Wafer Level Research Around the World
· Nano Wafer Level Packaging

TECHNICAL PROGRAM CHAIRS:

Mahadevan K. Iyer
IME, Singapore
iyer@ime.org.sg

CP Wong
Georgia Institute of Technology
cp.wong@mse.gatech.edu

Herbert Reichl
IZM, Germany

Abstract Submission:
Please send your abstract electronically to wlp@ee.gatech.edu by November 19, 2001: