APACK 2001

An International Conference on Advances in Packaging

2nd Call-for-Papers

**Singapore International Convention & Exhibition Center (SiCEC)

5th - 7th December 2001

APACK 2001 is an international conference on Advances in Packaging. This conference is a global platform for researchers and indukstry practitioners to exchange ideas and present innovative solutions in electronics packaging and address challenges faced by the electronics industry.

Dec 5: Workshops and Forum

** Flip Chip -- From IC Design through Assembly, by Peter Elenius, Flip Chip Technologies

** Solder Joint Reliability: Materials, Modeling & Testing, by Ahmer Syed, Amkor & John Pang, NTU

** Polymer for Wafer-Level Packaging, by C. P. kWong, Georgia Institute of Technology

Dec 6 - 7: Conference

You are invited to submit your abstracts of about 300 words for any of the following tracks (by May 31 if possible)

** Array Packages (BGA, CSP) -- Code = ARP

** Leadfram and Leadless packages -- Code = LFLP

** Advanced Packaging (3D, MCM) -- Code = ADP

**MEMs & Photonics Packaging -- Code = MEMS

** Thermal Design and Management -- Code = TDM

** Electrical Design & Characterization -- Code = EDC

** Environmental-Friendly Manufacturing -- Code = EFM

** Substrate Technology -- Code = ST

** Reliability -- Code = REL

** Materials & Processes -- Code = MP

** Modeling & Simulation -- Code = MS

EXHIBITION
Companies from the electronics packaging industry can take this opportunity to reach a very targeted audience during the 2-day conference cum exhibition. The tabletop exhibition site will allow you to maximize the exposure of your organization and business.

Send abstract or requests to:

APACK 2001 Secretariat

71 Nanyang Drive, Singapore 638075

E-Mail: kfchan@gintic.gov.sg

Tel: (65) 793 8423

Fax: (65) 7912927