AREA ARRAY PACKAGING TECHNOLOGIES

Fourth International Workshop on Flip Chip, CSP, Wafer Level Packaging

Berlin, Germany, November, 12 - 14, 2001 right after Productronica

Special Sessions:

Optoelectronics Packaging

MEMS Packaging

Organizer: IEEE - CPMT German Chapter

Conference Chair -- Dr. Elke Zakel, Pac Tech GmbH, Germany

International Advisory Committee:

Dr. Koji Nihei, Waseda University, Japan

Dr. Paul Totta, IBM Corporation, USA

The German Chapter of IEEE - CPMT Society is organizing a conference on flip chip, CSP and wafer level packaging technologies. The conference will be conducted in signle, sequential sessions so that attendees will be able to hear every paper. Most papers will be 30 minutes long with time for questions and discussions.

TOPICS

Wafer Level Packaging - Optoelectronics Packaging - MEMS Packaging

System in a package
Assembly
Molding, encapsulation technology
 
Chip Size Packages
Packaging concepts
Interconnection technology
Performance
Testing
Molding, encapsulation
Applications and cost
Reliability
Inspection and testing
Electrical and thermal performance
Burn-in
Equipment
Reliability
Standarization of packages and test methods
Production experience
Process control
yield issues
Repair
Applications
 
 
Flip Chip in Package (FCIP) versus Flip Chip on Board (FCOB)
Bumping
Low Cost technologies
Soldering, fluxless processes
Adhesive bonding
Underfill, encapsulation
Flip Chip on glass
Flip Chip on MCM-L, MCM-D, and MCM-C substrates
Flip Chip on rigid and flexible printed wiring boards
Assembly processe
Compatibility to SMT
Burn-in, test and repair
Reliability
Electrical and mechanical simulation
Cost
Applications
Equipment
Markets
 

PAPER SUBMISSION

Authors are invited to submit papers describing recent work. Papers may be extended abstracts or full papers. In either case, clearly describe the nature of the work, explain its significance and highlight novel features. On the title page, please indicate title, name and affiliation of all authors, an abstract of 100 words and suggested session topics. Also identify a contact author and include a complete mailing address, email address, phone and fax number.

Abstracts must be received by September 24, 2001. Authors will be notified of paper acceptance by the beginning of October 2001. The extended abstracts supplemented with up to four of your most important figures or full papers have to be submitted by October 22, 2001 and will be implemented in a conference handout.

Please, send abstracts to the following address:

Dr. Elke Zakel
IEEE - CPMT - German Chapter
Gustav - Meyer - Allee 25
Building 12, Entrance 1a
D - 13355 Berlin, Germany
 
email: elke.zakel@ieee.org

EXHIBITS

The conference is interested in corporate sponsors and technical exhibits relating to the theme of the conference. A vendors reception will be held during the conference. The list of exhibitors and sponsors will be included in the final program. Companies which are interested in the participation of the exhibition should contact Mrs. Evelyn Erlebach, Phone + 49(0) 30/46 78 15 - 55 (-0), Fax + 49 (0) 30/ 46 7815 - 51.

For more information: www.pactech.de/CPMT-Germany